纳米尺度单晶铜材料表面切削特性分子动力学模拟 |
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纳米尺度单晶铜材料表面切削特性分子动力学模拟
李勇 ; 杨晓京
【摘
要】 The surface cutting properties of single crystal copper material were researched by using molecular dynamics simulation.Through molecular dynamics modeling,calculation and analysis,the influences of different cutting speeds or cutting thicknesses on single crystal copper surface nano-cut-ting process microscopic atomic states and the change rule of contact area cutting force were studied. The results show that the accumulated volume of chips increases with the cutting speed increases in nano-cutting process of single crystal copper surface,at the same time the atoms in the chip stack are tighter and the distribution of dislocation defects is wider.The accumulated volume of chips in front of tool and the dislocation defects increase with the cutting thickness increases in a same cutting speed.In different cutting speeds or cutting thicknesses,the cutting force will rise at first,and float around a stable value after reaching a steady stage.During initial stage of cutting,the higher the cutting speed or cutting thickness,the larger rise range of cutting force.After reaching the steady stage of cutting, the higher the cutting speed or cutting thickness,the larger cutting force.% 采用分子动力学模拟方法研究单晶铜材料表面纳米切削特 性 . 通过对单晶铜纳米切削过程进行分子动力学建模、计算与分析 , 研究了不同切削 速度及切削厚度对单晶铜材料表面纳米切削过程中微观接触区域原子状态和切削力 变化的影响规律 . 研究结果发现 : 在单晶铜表面纳米切削过程中 , 切削速度越高 , 切屑堆 积体积越大 , 切屑里原子的排列越紧密 , 位错缺陷分布区域越大 ; 在同种切削速度下 , 切 |
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