2160856040 |
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216-0856040 Part Number 216-0856040 Manufacturer AMD BGA Alloy No Pb/Lead Free Date Code 2009 Package/Case 360 Description Original new Technical Support BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls. Lead-free/No Pb BGA chips: 245C-260C(Maximun) Leaded/Pb BGA chips: 180C-205C(Maximun) Sufficient Stock |
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