With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

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Underfill technology effectively enhances the flip - chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.

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The shear strength of COG and COF bonded with ACF is studied by impact test.

采用冲击试验方法研究了各向异性导电胶膜(ACF) 互连的玻璃和柔性基板上倒装芯片(COG和COF)的剪切结合强度.

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