无卤，高CTI，铝基覆铜板

2024-07-16 13:51| 来源: 网络整理| 查看: 265

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Remarks:

1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

ItemsMethodConditionUnitTypical ValueThermal ConductivityASTM-D5470AW/ (m•K) 1.1Thermal ResistanceASTM-D5470AK·cm2/W 0.91Tg2.4.25DDSC℃100Td 2.4.24.6Wt 5% loss℃410Thermal Stress2.4.13.1288℃, solder floatmin 30CTE (Z-axis)2.4.24Before Tgppm/℃27After Tgppm/℃3050-260℃%0.74Volume Resistivity2.5.17.1C-96/35/90MΩ.cm106 Surface Resistivity 2.5.17.1 C-96/35/90MΩ107 Dielectric Breakdown2.5.6D-48/50+D-0.5/23kV6.0Peel Strength (1oz)2.4.8288℃/10sN/mm1.4Flammability UL94 C-48/23/50 Rating V-0MOTULA℃130CTIIEC60112ARatingPLC0

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无卤，高CTI，铝基覆铜板

无卤，高CTI，铝基覆铜板

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