Journal Papers

Wen-Sheng Zhao, Xiao-Peng Wang, Wen-Yan Yin, Electrothermal effects in high density through-silicon via (TSV) array, Progress In Electromagnetics Research, vol. 115, pp. 223-242, 2011

Wen-Sheng Zhao, Wen-Yan Yin, Xiao-Peng Wang, Xiao-Long Xu, Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 58, no. 10, pp. 3358-3368, October 2011

Jiang-Peng Cui, Wen-Sheng Zhao, Wen-Yan Yin, Jun Hu, Signal transmission analysis of multilayer graphene nano-ribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 126-132, February 2012

Wen-Sheng Zhao, Wen-Yan Yin, Yong-Xin Guo, Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 149-157, February 2012  

Lin-Juan Huang, Wen-Sheng Zhao, Thermo-mechanical analysis of an improved thermal through silicon via (TTSV) structure, Progress In Electromagnetics Research M, vol. 30, pp. 51-66, 2013

Xu-Chen Wang, Wen-Sheng Zhao, Jun Hu, Tian Zhang, A novel tunable antenna using graphene-based artificial magnetic conductor (AMC), Progress In Electromagnetics Research Letters, vol. 41, pp. 29-38, 2013

Wen-Sheng Zhao, Lingling Sun, Wen-Yan Yin, Yong-Xin Guo, Electrothermal modelling and characterisation of submicron through-silicon carbon nanotube bundle vias for three-dimensional ICs, Micro & Nano Letters, vol. 9, no. 2, pp. 123-126, February 2014

R. Zhang, W.S. Zhao, W.Y. Yin, Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs, Microelectronics Reliability, vol. 54, no. 3, pp. 575-581, March 2014  

王高峰，赵文生，三维集成电路中的关键技术问题综述，杭州电子科技大学学报，34(2): 1-7, 2014年3月

Yun-Fan Liu, Wen-Sheng Zhao, Zheng Yong, Yuan Fang, Wen-Yan Yin, Electrical modeling of three-dimensional carbon-based heterogeneous interconnects, IEEE Transactions on Nanotechnology, vol. 13, no. 3, pp. 488-495, May 2014

Wen-Sheng Zhao, Gaofeng Wang, Lingling Sun, Wen-Yan Yin, Yong-Xin Guo, Repeater insertion for carbon nanotube interconnects, Micro & Nano Letters, vol. 9, no. 5, pp. 337-339, May 2014

Wen-Sheng Zhao, Wen-Yan Yin, Comparative study on multilayer graphene nanoribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 3, pp. 638-645, June 2014

Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, Wen-Yan Yin, Electrical modeling of on-chip Cu-graphene heterogeneous interconnects, IEEE Electron Device Letters, vol. 36, no. 1, pp. 74-76, January 2015

Xu-Chen Wang, Wen-Sheng Zhao, Jun Hu, Wen-Yan Yin, Reconfigurable terahertz leaky-wave antenna using graphene-based high-impedance surface, IEEE Transactions on Nanotechnology, vol. 14, no. 1, pp. 62-69, January 2015

R. Zhang, W.S. Zhao, W.Y. Yin, Z.G. Zhao, H.J. Zhou, Impacts of diamond heat spreader on the thermo-mechanical characteristics of high-power AlGaN/GaN HEMTs, Diamond & Related Materials, vol. 52, pp. 25-31, 2015

Rui Zhang, Wen-Sheng Zhao, Jun Hu, Wen-Yan Yin, Electrothermal characterization of multilevel Cu-graphene heterogeneous interconnects in the presence of an electrostatic discharge (ESD), IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 205-209, March 2015

Da-Wei Wang, Wen-Sheng Zhao, Xiao-Qiang Gu, Wenchao Chen, Wen-Yan Yin, Wideband modeling of graphene-based structures at different temperatures using hybrid FDTD method, IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 250-258, March 2015

Wen-Sheng Zhao, Gaofeng Wang, Jun Hu, Lingling Sun, Hui Hong, Performance and stability analysis of monolayer single-walled carbon nanotube interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 28, no. 4, pp. 456-464, July/August 2015

Wen-Sheng Zhao, Rui Zhang, Yuan Fang, Wen-Yan Yin, Gaofeng Wang, Kai Kang, High-frequency modeling of Cu-graphene heterogeneous interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 29, no. 2, pp. 157-165, March/April 2016

Wen-Sheng Zhao, Jie Zheng, Feng Liang, Kuiwen Xu, Xi Chen, Gaofeng Wang, Wideband modeling and characterization of differential through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 63, no. 3, pp. 1168-1175, March 2016

Wenchao Chen, Wen-Yan Yin, Wen-Sheng Zhao, Ran Hao, Erping Li, Kai Kang, Jing Guo, Scaling analysis of high gain monolayer MoS2 photodetector for its performance optimization, IEEE Transactions on Electron Devices, vol. 63, no. 4, pp. 1608-1614, April 2016

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, Wenchao Chen, Wen-Yan Yin, Electrothermal cosimulation of 3-D carbon-based heterogeneous interconnects, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no, 4, pp. 518-526, April 2016

Wen-Sheng Zhao, Jie Zheng, Yue Hu, Shilei Sun, Gaofeng Wang, Linxi Dong, Liyang Yu, Lingling Sun, Wen-Yan Yin, High-frequency analysis of Cu-carbon nanotube composite through-silicon vias, IEEE Transactions on Nanotechnology, vol. 15, no. 3, pp. 506-511, May 2016

Jing Wang, Mengqiu Long, Wen-Sheng Zhao, Yue Hu, Gaofeng Wang, K S Chan, A valley and spin filter based on gapped graphene, Journal of Physics: Condensed Matter, vol. 28, no. 28, p. 285302, 2016

Wen-Sheng Zhao, Jie Zheng, Linxi Dong, Feng Liang, Yue Hu, Luwen Wang, Gaofeng Wang, Qifa Zhou, High-frequency modeling of on-chip coupled carbon nanotube interconnects for millimeter-wave applications, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 8, pp. 1226-1232, August 2016

Linxi Dong, Jiaping Tao, Jinyan Bao, Wen-Sheng Zhao, Gaofeng Wang, Anchor loss variation in MEMS wine-glass mode disk resonators due to fluctuating fabrication process, IEEE Sensors Journal, vol. 16, no. 18, pp. 6846-6856, September 2016

Aobo Chen, Feng Liang, Bing-Zhong Wang, Wen-Sheng Zhao, Gaofeng Wang, Conduction mode analysis and impedance extraction of shielded pair transmission lines, IEEE Microwave and Wireless Components Letters, vol. 26, no. 9, pp. 654-656, September 2016

Fei Wen, Xiaoyang Liu, Zhuo Xu, Hua Tang, Wangfeng Bai, Wen-Sheng Zhao, Peng Zheng, Luwen Wang, Gaofeng Wang, Low loss and high permittivity composites based on poly(vinylidene fluoride-chlorotrifluoroethylene) and lead lanthanum zirconate titanate, Ceramics International, vol. 43, no. 1, part B, pp. 1504-1508, January 2017

Wen-Sheng Zhao, Jie Zheng, Shichang Chen, Xiang Wang, Gaofeng Wang, Transient analysis of through-silicon vias in floating silicon substrate, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 1, pp. 207-216, February 2017

Alessandro Giuseppe D'Aloia, Wen-Sheng Zhao, Gaofeng Wang, Wen-Yan Yin, Near-field radiated from carbon nanotube and graphene-based nanointerconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 2, pp. 646-653, April 2017

Jing Wang, Haorui Lu, Yue Hu, Wen-Sheng Zhao, Gaofeng Wang, K S Chan, Quantum pumping of layer pseudospin current in biased bilayer graphene, Journal of Physcis D: Applied Physics, vol. 50, no. 20, p. 205101, April 2017

Wen-Sheng Zhao, Jie Zheng, Jing Wang, Feng Liang, Fei Wen, Linxi Dong, Dingwen Wang, Gaofeng Wang, Modeling and characterization of coaxial through-silicon via with electrical floating inner silicon, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 936-943, June 2017

Kuiwen Xu, Fei Liu, Liang Peng, Wen-Sheng Zhao, Lixin Run, Gaofeng Wang, Multimode and wideband printed loop antenna based on degraded split-ring resonators, IEEE Access, vol. 5, pp. 15561-15570, August 2017

Yue Hu, Yanfei Gong, Huazhen Liu, Qianqian Xu, Wen-Sheng Zhao, Jing Wang, Ying Wang, Gaofeng Wang, Numerical investigation of high-voltage partial buried P/N-layer SOI LDMOS, IEEE Transactions on Electron Devices, vol. 64, no. 9, pp. 3725-3733, September 2017

Qi-Lin Gu, Peng Zhang, Yi Ru, Hao Song, Wen-Sheng Zhao, A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs, Microelectronics Reliability, vol. 78, pp. 362-369, November 2017

Zi-Han Cheng, Wen-Sheng Zhao, Linxi Dong, Jing Wang, Peng Zhao, Haijun Gao, Gaofeng Wang, Investigation of copper-carbon nanotube composites as global VLSI interconnects, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 891-900, November 2017

Da-Wei Wang, Wen-Sheng Zhao, Hao Xie, Jun Hu, Liang Zhou, Wenchao Chen, Pingqi Gao, Jichun Ye, Yang Xu, Hong-Sheng Chen, Er-Ping Li, Wen-Yan Yin, Tunable THz multiband frequency-selective surface based on hybrid metal-graphene structures, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 1132-1137, November 2017

王高峰，赵文生，孙玲玲，碳基无源器件研究进展综述，电子学报，45(12): 3037-3045, 2017年12月

Haonan Wang, Linxi Dong, Wei Wei, Wen-Sheng Zhao, Kuiwen Xu, Gaofeng Wang, The WSN monitoring system for large outdoor advertising boards based on ZigBee and MEMS sensor, IEEE Sensors Journal, vol. 18, no. 3, pp. 1314-1323, February 2018

Peng-Wei Liu, Zi-Han Cheng, Wen-Sheng Zhao, Qijun Lu, Zhangming Zhu, Gaofeng Wang, Repeater insertion for multi-walled carbon nanotube interconnects, Applied Sciences, vol. 8, no. 2, p. 236, February 2018

Peng Zhao, Yihang Zhang, Rongrong Sun, Wen-Sheng Zhao, Yue Hu, Gaofeng Wang, Design of a novel miniaturized frequency selective surface based on 2.5-dimensional Jerusalem cross for 5G applications, Wireless Communications and Mobile Computing, vol. 2018, p. 3485208, April 2018

Xiang Fang, Linxi Dong, Wen-Sheng Zhao, Haixia Yan, Kwok Siong Teh, Gaofeng Wang, Vibration-induced errors in MEMS tuning fork gyroscopes with imbalance, Sensors, vol. 18, no. 6, p. 1755, May 2018

Jing Jin, Wen-Sheng Zhao, Da-Wei Wang, Hong-Sheng Chen, Er-Ping Li, Wen-Yan Yin, Investigation of carbon nanotube-based through-silicon vias for PDN applications, IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 3, pp. 738-746, June 2018

Wen-Sheng Zhao, Zi-Han Cheng, Jing Wang, Kai Fu, Da-Wei Wang, Peng Zhao, Gaofeng Wang, Linxi Dong, Vertical graphene nanoribbon interconnects at the end of the roadmap, IEEE Transactions on Electron Devices, vol. 65, no. 6, pp. 2632-2637, June 2018

Jing Jin, Wen-Sheng Zhao, Da-Wei Wang, Liang Zhou, Wen-Yan Yin, Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 31, no. 4, p. e2348, July/August 2018

Kai Fu, Wen-Sheng Zhao, Gaofeng Wang, Madhavan Swaminathan, Modeling and performance analysis of shielded differential annular through-silicon via (SD-ATSV) for 3-D ICs, IEEE Access, vol. 6, pp. 33238-33250, July 2018

Wen-Sheng Zhao, Da-Wei Wang, Alessandro Giuseppe D'Aloia, Wenchao Chen, Gaofeng Wang, Wen-Yan Yin, Recent progress of nano-electromagnetic compatibility (nano-EMC) in emerging carbon nanoelectronics, IEEE Electromagnetic Compatibility Magazine, vol. 7, no. 2, pp. 71-81, July 2018

Kai Fu, Wen-Sheng Zhao, Gaofeng Wang, Madhavan Swaminathan, A passive equalizer design for shielded differential through-silicon vias in 3-D ICs, IEEE Microwave and Wireless Components Letters, vol. 28, no. 9, pp. 768-770, September 2018

Zi-Han Cheng, Wen-Sheng Zhao, Da-Wei Wang, Jing Wang, Linxi Dong, Gaofeng Wang, Wen-Yan Yin, Analysis of Cu-graphene interconnects, IEEE Access, vol. 6, pp. 53499-53508, October 2018

Kai Fu, Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, Madhavan Swaminathan, Wen-Yan Yin, A compact passive equalizer design for differential channels in TSV-based 3-D ICs, IEEE Access, vol. 6, pp. 75278-75292, November 2018

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, Wen-Yan Yin, High-frequency electrothermal characterization of TSV-based power delivery network, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 12, pp. 2171-2179, December 2018

Da-Wei Wang, Wenchao Chen, Wen-Sheng Zhao, Guo-Dong Zhu, Kai Kang, Pingqi Gao, Jose E. Schutt-Aine, Wen-Yan Yin, Fully coupled electrothermal simulation of large RRAM arrays in the thermal-house, IEEE Access, vol. 7, pp. 3897-3908, January 2019

Wen-Sheng Zhao, Peng-Wei Liu, Huan Yu, Yue Hu, Gaofeng Wang, Madhavan Swaminathan, Repeater insertion to reduce delay and power dissipation in copper and carbon nanotube-based nanointerconnects, IEEE Access, vol. 7, pp. 13622-13633, February 2019

Da-Wei Wang, Wenchao Chen, Wen-Sheng Zhao, Guo-Dong Zhu, Zhen-Guo Zhao, Jose E. Schutt-Aine, Wen-Yan Yin, An improved algorithm for drift diffusion transport and its application on large scale parallel simulation of resistive random access memory arrays, IEEE Access, vol. 7, pp. 31273-31285, March 2019

Zi-Han Cheng, Wen-Sheng Zhao, Da-Wei Wang, Jing Wang, Linxi Dong, Gaofeng Wang, Modelling and delay analysis of on-chip differential carbon nanotube interconnects, Micro & Nano Letters, vol. 14, no. 5, pp. 505-510, May 2019

Wen-Sheng Zhao, Kai Fu, Da-Wei Wang, Meng Li, Gaofeng Wang, Wen-Yan Yin, Mini-review: Modeling and performance analysis of nanocarbon interconnects, Applied Sciences, vol. 9, no. 11, p. 2174, May 2019

Da-Wei Wang, Wen-Sheng Zhao, Rui-Zhen Wang, Wenchao Chen, Wen-Yan Yin, Terahertz frequency selective surface based on metal-graphene structure with independent frequency tuneability, IET Microwaves, Antennas & Propagation, vol. 13, no. 7, pp. 911-916, July 2019

Kai Fu, Jie Zheng, Wen sheng Zhao, Yue Hu, Gaofeng Wang, Analysis of transmission characteristics of copper/carbon nanotube composite through-silicon via interconnects, Chinese Journal of Electronics, vol. 28, no. 5, pp. 920-924, September 2019

Jin-Wei Pan, Kai Fu, Qi Liu, Wen-Sheng Zhao, Linxi Dong, Gaofeng Wang, Modelling of crosstalk in differential through silicon vias for three-dimensional integrated circuits, IET Microwaves, Antennas & Propagation, vol. 13, no. 10, pp. 1529-1535, October 2019

Yuan-Yuan Zhang, Wen-Sheng Zhao, Qi Liu, Gaofeng Wang, Novel electromagnetic bandgap structure for wideband suppression of simultaneous switching noise, Electronics Letters, vol. 55, no. 23, pp. 1243-1245, November 2019

Qi Liu, Hui Li, Yu-Feng Yu, Wen-Sheng Zhao, Shuai Zhang, A novel finger-controlled passive RFID tag design for human-machine interaction, Sensors, vol. 19, no. 23, p. 5125, November 2019

Yue Hu, Zhifeng Liu, Shichang Chen, Jing Wang, Wen-Sheng Zhao, Gaofeng Wang, Numerical investigation on L-shaped vertical field plate in high-voltage LDMOS, Results in Physics, vol. 15, p. 102547, December 2019

Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Guodong Zhu, Hao Xie, Pingqi Gao, Wen-Yan Yin, Parallel simulation of fully coupled electrothermal processes in large-scale phase-change memory arrays, IEEE Transactions on Electron Devices, vol. 66, no. 2, pp. 5117-5125, December 2019

Linxi Dong, Zhiyuan Qiao, Haonan Wang, Weihuang Yang, Wensheng Zhao, Kuiwen Xu, Gaofeng Wang, Libo Zhao, Haixia Yan, The gas leak detection based on a wireless monitoring system, IEEE Transactions on Industrial Informatics, vol. 15, no. 12, pp. 6240-6251, December 2019

Li-Chao Fan, Wen-Sheng Zhao, Hong-Yi Gan, Li He, Qi Liu, Linxi Dong, Gaofeng Wang, A high-Q active substrate integrated waveguide based sensor for fully characterizing magneto-dielectric (MD) materials, Sensors and Actuators A: Physical, vol. 301, p. 111778, January 2020

Qi Liu, Yu-Feng Yu, Wen-Sheng Zhao, Hui Li, Microfluidic temperature sensor based on temperature-dependent dielectric property of liquid, Chinese Physics B, vol. 29, no. 1, p. 010701, January 2020

Hong-Yi Gan, Wen-Sheng Zhao, Li He, Yufeng Yu, Kuiwen Xu, Fei Wen, Linxi Dong, Gaofeng Wang, A CSRR-loaded planar sensor for simultaneously measuring permittivity and permeability, IEEE Microwave and Wireless Components Letters, vol. 30, no. 2, pp. 219-221, February 2020

Wen Li, Wen-Sheng Zhao, Peng-Wei Liu, Jing Wang, Gaofeng Wang, Optimal repeater insertion for horizontal and vertical graphene nanoribbon interconnects, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 33, no. 2, p. e2696, March/Aprial 2020

Fan Jiang, Wen-Sheng Zhao, Jun Zhang, Mini-review: Recent progress in the development of MoSe2 based chemical sensors and biosensors, Microelectronics Engineering, vol. 225, p. 111279, March 2020

Wen-Sheng Zhao, Hong-Yi Gan, Li He, Qi Liu, Da-Wei Wang, Kuiwen Xu, Shichang Chen, Linxi Dong, Gaofeng Wang, Microwave planar sensors for fully characterizing magneto-dielectric materials, IEEE Access, vol. 8, pp. 41985-41999, March 2020

Qing-Hao Hu, Wen-Sheng Zhao, Kai Fu, Gaofeng Wang, Modeling and characterization of differential multibit carbon-nanotube through-silicon vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 534-537, March 2020

Peng-Wei Liu, Wen-Sheng Zhao, Da-Wei Wang, Jing Wang, Yue Hu, Gaofeng Wang, Optimal repeater insertion for nano-interconnects in current-mode signalling scheme, Micro & Nano Letters, vol. 15, no. 5, pp. 308-312, May 2020

Hong-Yi Gan, Wen-Sheng Zhao, Qi Liu, Da-Wei Wang, Linxi Dong, Gaofeng Wang, Wen-Yan Yin, Differential microwave microfluidic sensor based on microstrip complementary split-ring resonator (MCSRR) structure, IEEE Sensors Journal, vol. 20, no. 11, pp. 5876-5884, June 2020

Wen-Sheng Zhao, Qing-Hao Hu, Yuan-Yuan Zhang, Da-Wei Wang, Jing Wang, Yue Hu, Gaofeng Wang, Modeling of carbon nanotube-based differential through-silicon vias in 3-D ICs, IEEE Transactions on Nanotechnology, vol. 19, pp. 492-499, July 2020

Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Hao Xie, Wen-Yan Yin, Fully coupled electrothermal simulation of resistive random access memory (RRAM) array, Science China - Information Sciences, vol. 63, no. 3, p. 189401, August 2020

Linxi Dong, Zhongren Xu, Weipeng Xu, Haixia Yan, Chaoran Liu, Wen-Sheng Zhao, Gaofeng Wang, Kwok Siong Teh, A characterization of the performance of gas sensor based on heater in different gas flow rate environment, IEEE Transactions on Industrial Informatics, vol. 16, no. 10, pp. 6281-6290, October 2020

Qi Liu, Wen-Sheng Zhao, Yufeng Yu, Broadband T-bar fed slot antenna array with stable horizontally polarized omnidirectional radiation, International Journal of RF and Microwave Computer-Aided Engineering, vol. 30, no. 11, pp. e22427, November 2020

Li-Chao Fan, Wen-Sheng Zhao, Da-Wei Wang, Shichang Chen, Gaofeng Wang, An ultrahigh sensitivity microwave sensor for microfluidic applications, IEEE Microwave and Wireless Components Letters, vol. 30, no. 12, pp. 1201-1204, December 2020

张鹏，孙晓冬，朱家和，王晶，王大伟，赵文生，集成微系统多物理场耦合数值计算关键技术综述，电子与封装，21(10): 100104，2021

Qing-Hao Hu, Wen-Sheng Zhao, Kai Fu, Da-Wei Wang, Gaofeng Wang, On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits, IET Circuits, Devices & Systems, vol. 15, no. 1, pp. 20-26, January 2021

Qi Liu, Wen-Sheng Zhao, Yufeng Yu, RFID-based bidirectional wireless rollover sensor for intelligent wheelchair, Microwave and Optical Technology Letters, vol. 63, no. 2, pp. 504-509, February 2021

Tao Wang, Junlong Zou, Gian Piero Puccioni, Wensheng Zhao, Xiao Lin, Hongsheng Chen, Gaofeng Wang, Gian Luca Lippi, Methodological investigation into the noise influence on nanolasers' large signal modulation, Optics Express, vol. 29, no. 4, pp. 5081-5097, February 2021

Qing-Hao Hu, Wen-Sheng Zhao, Kai Fu, Da-Wei Wang, Gaofeng Wang, Electrical modeling of carbon nanotube-based shielded through-silicon vias for three-dimensional integrated circuits, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 34, no. 3, p. e2842, May/June 2021

Hao Jiang, Xiaokang Qi, Quan Wang, Kuiwen Xu, Shichang Chen, Liang Wu, Fang Zhu, Wen-Sheng Zhao, Linxi Dong, Lixin Ran, Gaofeng Wang, High-precision dielectric sensor system based on balanced CSRR-SIW resonators, International Journal of RF and Microwave Computer-Aided Engineering, vol. 31, no. 7, p. e22696, July 2021

Hong-Yi Gan, Wen-Sheng Zhao, Da-Wei Wang, Jing Wang, Qi Liu, Gaofeng Wang, High-Q active microwave sensor based on microstrip complementary split-ring resonator (MCSRR) structure for dielectric characterization, Applied Computational Electromagnetics Society Journal, vol. 36, no. 7, pp. 922-927, July 2021

Yi-Hao Ma, Liang-Hao Ruan, Jing Wang, Wen-Sheng Zhao, Yue Hu, Yuhua Cheng, Da-Wei Wang, Gaofeng Wang, Spatial selected spin filtering effect in Z-shaped MoS2 nanoribbon, IEEE Access, vol. 9, pp. 106784-106789, August 2021

Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao, Jiangtao Su, Bin You, Jun Liu, Multiphysics analysis and optimal design of compressible micro-interconnect for 2.5D/3D heterogeneous integration, Electronics, vol. 10, no. 18, p. 2240, September 2021

Jia-He Zhu, Da-Wei Wang, Wen-Sheng Zhao, Jia-Yun Dai, Gaofeng Wang, A proposal for vertical MOSFET and electrothermal analysis for monolithic 3-D ICs, Electronics, vol. 10, no. 18, p. 2041, September 2021

Wen-Jing Wu, Wen-Sheng Zhao, Da-Wei Wang, Bo Yuan, Gaofeng Wang, Ultrahigh-sensitivity microwave microfluidic sensors based on modified complementary electric-LC and split-ring resonator structures, IEEE Sensors Journal, vol. 21, no. 17, pp. 18756-18763, September 2021

Bin-Xiao Wang, Wen-Sheng Zhao, Da-Wei Wang, Wen-Jing Wu, Qi Liu, Gaofeng Wang, Sensitivity optimization of differential microwave sensors for microfluidic applications, Sensors and Actuators A: Physical, vol. 330, p. 112866, October 2021

Wen-Jing Wu, Wen-Sheng Zhao, Da-Wei Wang, Bo Yuan, Gaofeng Wang, A temperature-compensated differential microstrip sensor for microfluidic applications, IEEE Sensors Journal, vol. 21, no. 21, pp. 24075-24083, November 2021

Da-Wei Wang, Wen-Sheng Zhao, Zheng-Min Zhang, Qi Liu, Hao Xie, Wenchao Chen, Wen-Yan Yin, Gaofeng Wang, A hybrid streamline upwind finite volume-finite element method for semiconductor continuity equations, IEEE Transactions on Electron Devices, vol. 68, no. 11, pp. 5421-5429, November 2021

Bin-Xiao Wang, Wen-Sheng Zhao, Da-Wei Wang, Junchao Wang, Wenjun Li, Jun Liu, Optimal design of planar microwave microfluidic sensors based on deep reinforcement learning, IEEE Sensors Journal, vol. 21, no. 24, pp. 27441-27449, December 2021

Ji Xu, Ying Sun, Jun Liu, Yi-Ding Wei, Wen-Sheng Zhao, Da-Wei Wang, Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration, Microelectronics Journal, vol. 119, p. 105332, January 2022

Jing Wang, R. Van Pottelberge, Wen-Sheng Zhao, Francois M. Peeters, Coulomb impurity on a Dice lattice: Atomic collapse and bound states, Physical Review B, vol. 105, p. 035427, January 2022

Peng-Wei Zhu, Xiang Wang, Wen-Sheng Zhao, Jing Wang, Da-Wei Wang, Fang Hou, Gaofeng Wang, Design of H-shaped planar displacement microwave sensors with wide dynamic range, Sensors and Actuators A: Physical, vol. 333, p. 113311, January 2022

Yu-Hao Fang, Wen-Sheng Zhao, Fu-Kang Lin, Da-Wei Wang, Junchao Wang, Wen-Jing Wu, An AMC-based liquid sensor optimized by particle-ant colony optimization algorithms, IEEE Sensors Journal, vol. 22, no. 3, pp. 2083-2090, February 2022

Wen-Sheng Zhao, Bin-Xiao Wang, Da-Wei Wang, Bin You, Qi Liu, Gaofeng Wang, Swarm intelligence algorithm-based optimal design of microwave microfluidic sensors, IEEE Transactions on Industrial Electronics, vol. 69, no. 2, pp. 2077-2087, February 2022

Wen-Jing Wu, Bo Yuan, Wen-Sheng Zhao, Gaofeng Wang, On-chip miniaturized bandpass filter using gallium arsenide-based integrated passive device technology, Microwave and Optical Technology Letters, vol. 64, no. 4, pp. 688-693, April 2022

王晶，范立超，王大伟，赵文生，基于EMSIW的多功能传感器设计，实验室研究与探索，41(5): 60-62，2022年5月

Qi Liu, Shuomin Zhong, Yufeng Yu, Wen-Sheng Zhao, Gaofeng Wang, Platform-tolerant nested-slot RFID tag antenna based on Jigsaw-shaped metasurface, IEEE Antennas and Wireless Propagation Letters, vol. 21, no. 5, pp. 943-947, May 2022

Wen-Sheng Zhao, Rui Zhang, Da-Wei Wang, Recent progress in physics-based modeling of electromigration in integrated circuit interconnects, Micromachines, vol. 13, no. 6, p. 883, May 2022

Kun Ren, Pengwen Zhu, Taotao Sun, Junchao Wang, Dawei Wang, Jun Liu, Wensheng Zhao, A complementary split-ring resonator (CSRR)-based 2D displacement sensor, Symmetry, vol. 14, no. 6, p. 1116, May 2022

Xin-Qing Lei, Jia-He Zhu, Da-Wei Wang, Wen-Sheng Zhao, Design for ultrahigh-density vertical phase change memory: Proposal and numerical investigation, Electronics, vol. 11, no. 12, p. 1822, June 2022

Hao Xu, Wen-Sheng Zhao, Da-Wei Wang, Jun Liu, Compact folded SSPP transmission line and its applications in low-pass filters, IEEE Photonics Technology Letters, vol. 34, no. 11, pp. 591-594, June 2022

王晶，张园园，王大伟，赵文生，基于EBG结构的微流体传感器设计与性能测试，实验室研究与探索，41(7): 72-75，2022年7月

Hao Xu, Wen-Sheng Zhao, Wen-Jing Wu, Da-Wei Wang, Haijun Gao, Yue Hu, Jun Liu, Miniaturized microwave microfluidic sensor based on quarter-mode 2.5-D spoof plasmons, Sensors and Actuators A: Physical, vol. 342, p. 113621, August 2022

Wen-Jing Wu, Wen-Sheng Zhao, Da-Wei Wang, Bo Yuan, Gaofeng Wang, An active microfluidic sensor based on slow-wave substrate integrated waveguide for measuring complex permittivity of liquids, Sensors and Actuators A: Physical, vol. 344, p. 113699, September 2022

赵文生，方宇浩，王大伟，刘军，微波谐振式传感器研究进展，电子学报，50(10): 2530-2541，2022年10月

Wen-Jing Wu, Wen-Sheng Zhao, Gaofeng Wang, A dielectric sensor based on differential microstrip lines coupled with multiple magnetic-LC resonators, IEEE Sensors Journal, vol. 22, no. 20, pp. 19327-19335, October 2022

Da-Wei Wang, Meng-Jiao Yuan, Jia-Yun Dai, Wen-Sheng Zhao, Electrical modeling and characterization of graphene-based on-chip spiral inductors, Micromachines, vol. 13, no. 11, p. 1829, October 2022

Fu-Kang Lin, Da-Wei Wang, Wen-Sheng Zhao, Yufeng Yu, Cheng Qian, An ultrahigh-sensitivity microwave angular displacement sensor with a wide dynamic range, Microwave and Optical Technology Letters, vol. 64, no. 10, pp. 1700-1706, October 2022

Wei Ye, Da-Wei Wang, Jing Wang, Gaofeng Wang, Wen-Sheng Zhao, An improved split-ring resonator-based sensor for microfluidic applications, Sensors, vol. 22, no. 21, p. 8534, November 2022

Wen-Jing Wu, Wen-Sheng Zhao, A quality factor enhanced microwave sensor based on modified split-ring resonator for microfluidic applications, IEEE Sensors Journal, vol. 22, no. 23, pp. 22582-22590, December 2022

Jian-Hong Fu, Wen-Jing Wu, Da-Wei Wang, Wen-Sheng Zhao, High-sensitivity microfluidic sensor based on quarter-mode interdigitated spoof plasmons, IEEE Sensors Journal, vol. 22, no. 24, pp. 23888-23895, December 2022

Yi-Hao Ma, Da-Wei Wang, Yufeng Yu, Wen-Sheng Zhao, Design of dual-band frequency-selective surfaces with independent tunability, IEEE Transactions on Antennas and Propagation, vol. 70, no. 12, pp. 12381-12386, December 2022

Wen-Sheng Zhao, Editorial for the special issue on advanced interconnect and packaging, Micromachines, vol. 14, no. 1, p. 171, January 2023

Wen-Jing Wu, Wen-Sheng Zhao, Da-Wei Wang, Bo Yuan, and Gaofeng Wang, A dual-mode microstrip sensor for simultaneously extracting complex permittivity and permeability of magnetodielectric samples, Sensors and Actuators A: Physical, vol. 349, p. 11400, January 2023

Zeng-Cai Zhang, Fang Hou, Da-Wei Wang, Jun Liu, Wen-Sheng Zhao, PSO-algorithm-assisted design of compact SSPP transmission line, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 3, pp. 247-250, March 2023

Wen-Jing Wu, Wen-Sheng Zhao, A differential THz/MW sensor for characterizing liquid samples based on CSRs, IEEE Sensors Journal, vol. 23, no. 10, pp. 10429-10436, May 2023

Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao, Bin You, Jun Liu, Cheng Qian, Hong-Bo Xu, Intelligent design and tunning method for embedded thermoelectric cooler (TEC) in 3D integrated microsystems, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 788-797, June 2023

Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao, Investigation on embedded microchannel heatsink for 2.5D integrated package, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 838-848, June 2023

Wei Ye, Da-Wei Wang, Jing Wang, Shichang Chen, Gaofeng Wang, Wen-Sheng Zhao, An ultrahigh-sensitivity dual-mode microwave sensor for microfluidic applications, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 7, pp. 1082-1084, July 2023

Wen-Jing Wu, Wen-Sheng Zhao, A differential microwave sensor loaded with magnetic-LC resonators for simultaneous thickness and permittivity measurement of material under test by odd- and even-mode, IEEE Sensors Journal, vol. 23, no. 12, pp. 12808-12816, June 2023

徐魁文，苏江涛，赵文生，李文钧，孙玲玲，强电磁干扰下射频集成微系统防护的挑战与机遇，安全与电磁兼容，2023(4): 9-17，2023年8月

Wen-Jing Wu, Lina Shang, Wen-Sheng Zhao, Gaofeng Wang, A dual-mode microwave sensor for retrieving permittivity of materials based on multiple complementary rectangular ring resonators, Measurement, vol. 218, p. 113215, August 2023

Wen-Jing Wu, Wen-Sheng Zhao, A modified MLC-based microwave sensing system for retrieving permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 15, pp. 16805-16813, August 2023

Maolin Sun, Haowei Xi, Xiaokang Qi, Kuiwen Xu, Huan Li, Qinyi Lv, Shaoqing Hu, Shichang Chen, Wen-Sheng Zhao, Xungen Li, and Wenjun Li, Reconfigurable transmitarray based on FSS for 2D wide-angle beam steering, Electronics, vol. 12, no. 18, p. 3854, September 2023

赵文生，张园园，王大伟，王晶，EBG结构的天线微流体传感器，实验室研究与探索，42(10): 61-63，2023年10月

Wen-Jing Wu and Wen-Sheng Zhao*, Microwave measurement system for characterizing liquid samples based on a modified HMSIW, IEEE Sensors Journal, vol. 23, no. 19, pp. 22466-22475, October 2023

Jian-Hong Fu, Wen-Jing Wu, Hao Xu, and Wen-Sheng Zhao*, A differential active SLSP-based microwave sensor for liquid characterization, IEEE Sensors Journal, vol. 23, no. 20, pp. 24420-24427, October 2023

Wen-Sheng Zhao, Meng-Jiao Yuan, Xiang Wang, and Da-Wei Wang, Circuit modeling and performance analysis of GNR@SWCNT bundle interconnects, Chinese Journal Electronics, vol. 32, no. 6, pp. 1271-1277, November 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor system based on oscillating technique for characterizing complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 21, pp. 25958-25970, November 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor based on frequency-locked-loop and multiple complementary split-ring resonators for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 24, pp. 30345-30359, December 2023

Da-Wei Wang, Jia-He Zhu, Yi-Fan Liu, Gaofeng Wang, and Wen-Sheng Zhao*, Modeling and simulation of RRAM with carbon nanotube electrode, IEEE Transactions on Nanotechnology, vol. 23, pp. 1-8, January 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel differential microwave sensor based on reflective-mode phase-variation of stepped-impedance transmission lines for extracting permittivity of dielectric materials, IEEE Sensors Journal, vol. 24, no. 3, pp. 2746-2757, February 2024

Qi Qiang Liu, Wen-Sheng Zhao*, Huan Wang, and Naixing Feng*, 3-D domain decomposition method with nonconformal meshes for thermoelastic modeling, IEEE Geoscience and Remote Sensing Letters, vol. 21, p. 7502105, February 2024

Hao Xu, Wen-Jing Wu, Wen-Sheng Zhao*, Wenxuan Tang, and Lingling Sun, Ultra-sensitive edible oil sensor based on spiral SLSP combined with stepped structure, IEEE Transactions on Instrumentation and Measurement, vol. 73, p. 6003209, February 2024

Jing Wang, Wen-Sheng Zhao, Yue Hu, R. N. Costa Filho, and Francois M. Peeters, Charged vacancy in graphene: Interplay between Landau levels and atomic collapse resonances, Physical Review B, vol. 109, p. 104103, March 2024

Wen-Bin Gao, Xuan Lin*, Guo-Sheng Li, Hong-Shun Yin, Fei-Long Lv, Peng Zhang, Da-Wei Wang*, Wen-Sheng Qian, Hao Zhang, and Wen-Sheng Zhao*, Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN, Microelectronics Journal, vol. 147, p. 106186, April 2024

Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, and Wen-Sheng Zhao*, Design of absorptive common-mode filters based on coupled stripline /4 resonator, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 649-658, April 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor based on modified rat-race coupler for extracting real permittivity and concentration of binary aqueous solution, IEEE Sensors Journal, vol. 24, no. 9, pp. 14213-14228, May 2024

Da-Wei Wang and Wen-Sheng Zhao, Editorial for the special issue on advanced interconnect and packaging, 2nd edition, Micromachines, vol. 15, no. 5, p. 643, May 2024.

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor system based on feedback-type oscillator and modified coplanar waveguide resonator for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 24, no. 13, pp. 20571-20586, July 2024.

Yi-Fan Deng, Yi-Hao Ma, Da-Wei Wang, Xiang Wang*, Wenjun Li*, and Wen-Sheng Zhao*, An absorptive common-mode suppression filter based on resistor-loaded M-type structure, IEEE Transactions on Circuits and Systems II: Express Briefs, vol. 71, no. 7, pp. 3484-3487, July 2024

Yi-Fan Liu, Da-Wei Wang*, Zhe-Kang Dong, Hao Xie, and Wen-Sheng Zhao*, Implementation of multiple-step quantized STDP based on novel memristive synapses, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2024. 

Yidan Zhang, Junchao Wang*, Jinkai Chen, Guodong Su, Wen-Sheng Zhao, and Jun Liu, Machine learning-enhanced predictive modeling for arbitrary deterministic lateral displacement design and test, IEEE Transactions on NanoBioscience, 2024. 

Yun-Cao Bao, Cheng-Hao Yu*, Wen-Sheng Zhao*, Xiao-Dong Wu, Xin Tan, and Yan Liu, Research of single-event burnout in vertical Ga2O3 FinFET by low carrier lifetime control, Semiconductor Science and Technology, 2024.

Jia-Hao Pan, Wen-Jing Wu, Qiqiang liu, Wen-Sheng Zhao*, Da-Wei Wang, Xiao-Ping Hu, Yue Hu, Jing Wang, Jun Liu, and Lingling Sun, Ultrahigh sensitivity resonat liquid sensor based on 3D comb-shaped capacitive structure, IEEE Transactions on Instrumentation and Measurement, in revision. 

Yi-Hao Ma, Da-Wei Wang, Wen-Sheng Zhao*, Cheng-Pan Huang, Bin You, Jun Liu, and Lingling Sun, A dielectric loss based absorptive common-mode filter using transmission space separation structure, IEEE Transactions on Microwave Theory and Techniques, in revision. 

Peng Zhang, Da-Wei Wang, and Wen-Sheng Zhao*, A thermal and power integrity co-optimization framework for 2.5-D integrated microsystem, IEEE Transactions on Circuits and Systems I: Regular Papers, resubmitted. 

Zhenxin Zhao, Jun Liu, Wen-Sheng Zhao, and Lihong Zhang, Automated topology synthesis of analog integrated circuits with frequency compensation, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, in revision. 

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A microwave sensing system combination of interdigital structure (IDS)-based microstrip line and RF circuits for extracting complex permittivity of liquid samples, Sensors and Actuators: A. Physical, resubmitted. 

Jia-He Zhu, Da-Wei Wang*, Gaofeng Wang, and Wen-Sheng Zhao*, Large on-state current vertical tunnel field-effect transistor: Modeling, design, and biosensor application, IEEE Sensors Journal, in revision.

Conference Papers

Wen-Sheng Zhao, Xiao-Peng Wang, Xiao-Long Xu, Wen-Yan Yin, Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs, IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Singapore, December 7-9, 2010

Xiao-Peng Wang, Wen-Sheng Zhao, Wen-Yan Yin, Electrothermal modeling of through silicon via (TSV) interconnects, IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Singapore, December 7-9, 2010

Wen-Yan Yin, Wen-Sheng Zhao, Modeling of carbon nanotube (CNT) interconnects, 15th IEEE Workshop on Signal Propagation on Interconnects (SPI), pp. 79-82, Naples, Italy, April 8-11, 2011

Wen-Sheng Zhao, Yong-Xin Guo, Wen-Yan Yin, Transmission characteristics of a coaxial through silicon via (C-TSV) interconnect, IEEE International Symposium on Electromagnetic Compatibility (EMC), pp. 373-378, Long Beach, CA, USA, August 14-19, 2011

Xiao-Long Xu, Wen-Sheng Zhao, Wen-Yan Yin, Modeling of a pair of annular through silicon vias (TSV), IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011

Wen-Sheng Zhao, Jun Hu, Wen-Yan Yin, Sensitivity analysis of through silicon via (TSV) interconnects for 3-D ICs, IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011

Xiao-Qing Miao, Lin-Juan Huang, Wen-Sheng Zhao, Wen-Yan Yin, Suppressing temperature rise in AlGaN/GaN HEMT with graphene layers, IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011

Yuan Fang, Wen-Sheng Zhao, Xu Wang, Feng Jiang, Wen-Yan Yin, Circuit modeling of multilayer graphene nanoribbon (MLGNR) interconnects, Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), pp. 625-628, Singapore, May 21-24, 2012

Yun-Fan Liu, Zheng Yong, Yan-Song Jiao, Wen-Sheng Zhao, Wen-Yan Yin, Electrothermal modeling of novel through silicon carbon nanotube bundle vias (TS-CNTBV), IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 53-56, Taipei, China, December 9-11, 2012

Wen-Sheng Zhao, Yong-Xin Guo, Wen-Yan Yin, Electrical characterization of through-silicon vias (TSV) with different physical configurations, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 173-176, Taipei, China, December 9-11, 2012

Wen-Sheng Zhao, Wen-Yan Yin, Signal integrity analysis of graphene nano-ribbon (GNR) interconnects, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 227-230, Taipei, China, December 9-11, 2012

Wen-Sheng Zhao, Wen-Yan Yin, Yong-Xin Guo, Electrical modeling of multi-walled carbon nanotube (MWCNT)-based capacitors for high-density RF integration, IEEE International Wireless Symposium (IWS), Beijing, China, April 14-18, 2013

X.-C. Wang, W.-Y. Li, W.-S. Zhao, J. Hu, Y.-Y. Xu, Q.-S. Huang, Comparative study on graphene-based artificial magnetic conductor (AMC), The 34th PIERS Proceedings, pp. 496-499, Stockholm, Sweden, August 12-15, 2013

Wen-Sheng Zhao, Yun-Fan Liu, Zheng Yong, Yuan Fang, Wen-Yan Yin, Modeling and characterization of carbon-based heterogeneous interconnects for 3-D ICs, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 154-157, Nara, Japan, December 12-15, 2013

Wen-Sheng Zhao, Sen-Sen Li, Rui Zhang, Wen-Yan Yin, Thermal modeling, analysis, and management of high-power GaN transistors using graphene, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 241-244, Nara, Japan, December 12-15, 2013

Jie Zheng, Da-Wei Wang, Wen-Sheng Zhao, Gaofeng Wang, Wen-Yan Yin, Modeling of TSV-based solenoid inductors for 3-D integration, IEEE International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China, July 1-3, 2015

Jie Zheng, Wen-Sheng Zhao, Gaofeng Wang, A systematic test approach for through-silicon via (TSV) process, IEEE International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China, July 1-3, 2015

Jie Zheng, Zhi-Qiang Su, Guan-Yi Wang, Meng Li, Wen-Sheng Zhao, Gaofeng Wang, Circuit modeling of Cu/CNT composite through-silicon vias (TSV), IEEE International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China, July 1-3, 2015

Wen-Sheng Zhao, Xu-Chen Wang, Jun Hu, Frequency- and beam-reconfigurable THz Fabry-Perot antenna based on hybrid Cu-graphene HIS, IEEE International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China, July 1-3, 2015

Da-Wei Wang, Rui Zhang, Wen-Yan Yin, Wen-Sheng Zhao, Gaofeng Wang, Modeling and characterization of Cu-graphene heterogeneous interconnects, IEEE 15th International Conference on Nanotechnology (IEEE NANO), pp. 499-502, Rome, Italy, July 17-22, 2015

Jie Zheng, Xu-Chen Wang, Wen-Sheng Zhao, Gaofeng Wang, Wen-Yan Yin, Lingling Sun, Towards 3-D carbon-based heterogeneous interconnects, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications (IEEE NEMO), pp. 1-3, Ottawa, ON, Canada, August 11-14, 2015

Da-Wei Wang, Wen-Sheng Zhao, Hong-Ke Ma, Wenchao Chen, Wen-Yan Yin, Modelling of multilayer graphene (MLG)-based structures at different temperatures, IEEE International Symposium on Electromagnetic Compatibility (EMC), pp. 1036-1040, Dresden, Germany, August 16-22, 2015

Jie Zheng, Xuan Gao, Qianqian Xu, Wen-Sheng Zhao, Gaofeng Wang, Frequency-thermal characterization of on-chip single-walled carbon nanotube interconnects, The 16th IEEE International Conference on Communication Technology, pp. 533-536, Hangzhou, China, October 18-21, 2015

Na Li, Junfa Mao, Wen-Sheng Zhao, Wen-Yan Yin, Electrothermal characteristics of carbon-based through-silicon via (TSV) channel, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, pp. 9-11, Seoul, South Korea, December 14-16, 2015

Xuan Gao, Jie Zheng, Wen-Sheng Zhao, Gaofeng Wang, Electrical modeling of on-chip copper-carbon nanotube composite interconnects, 7th Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity (APEMC), pp. 229-231, Shenzhen, China, May 18-21, 2016

J. Zheng, X. Gao, W.-S. Zhao, G. Wang, Electrical modeling of carbon nanotube based through-silicon vias for three-dimensional ICs, The 37th PIERS Proceedings, pp. 2594-2597, Shanghai, China, August 8-11, 2016

J. Zheng, X. Gao, W.-S. Zhao, G. Wang, Impact of nonlinear MOS capacitance effect on transient analysis of interposer through-silicon vias, The 37th PIERS Proceedings, pp. 2164-2167, Shanghai, China, August 8-11, 2016

X. Gao, J. Zheng, W.-S. Zhao, G. Wang, Analysis of on-chip copper-single-walled carbon nanotube composite interconnects using transmission-line model, The 37th PIERS Proceedings, pp. 2160-2163, Shanghai, China, August 8-11, 2016

Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, Wen-Yan Yin, A design of tunable high-impedance surface (HIS) based on hybrid metal-graphene structure, Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP), Xi’an, China, October 16-19, 2017

Jing Jin, Wen-Sheng Zhao, Da-Wei Wang, Wen-Yan Yin, Modeling of power distribution network based on multi-walled carbon nanotube TSVs for 3-D ICs, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, Haining, China, December 14-16, 2017

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, Wen-Yan Yin, Electrothermal co-simulation of a two-chip power delivery network in frequency domain, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, Haining, China, December 14-16, 2017

Jin-Wei Pan, Kai Fu, Zi-Han Cheng, Wen-Sheng Zhao, Gaofeng Wang, Modeling of crosstalk effects in carbon nanotube based differential through-silicon via array, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, Haining, China, December 14-16, 2017

Kai Fu, Jin-Wei Pan, Jing Jin, Wen-Sheng Zhao, Gaofeng Wang, The impact of current return path on the signal propagation in the through-silicon via array, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, Haining, China, December 14-16, 2017

Qiu-Yi Yang, Zi-Han Cheng, Wen-Sheng Zhao, Gaofeng Wang, Stability analysis of coupled copper-carbon nanotube (Cu-CNT) composite interconnects, IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, Haining, China, December 14-16, 2017

Jin-Wei Pan, Kai Fu, Wen-Sheng Zhao, Kuiwen Xu, Linxi Dong, Gaofeng Wang, An ultracompact Butterworth low-pass filter based on vertical spiral TSV inductor, The 11th International Conference on Microwave and Millimeter Wave Technology, Guangzhou, China, May 19-22, 2019

Da-Wei Wang, Guodong Zhu, Hao Xie, Wen-Yan Yin, Wenchao Chen, Wen-Sheng Zhao, Parallel modeling fully coupled multiphysics process in resistive random access memory array, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO 2019), Cambridge, MA, USA, May 29-31, 2019

Peng-Wei Liu, Wen-Sheng Zhao, Gaofeng Wang, A repeater optimization methodology for global multi-walled carbon nanotube interconnects, 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA, July 7-12, 2019

Wen-Sheng Zhao, Kai Fu, Gaofeng Wang, A passive equalizer design for on-interposer differential interconnects in 2.5D/3D ICs, IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2019), Nanjing, China, August 28-30, 2019

Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Wen-Yan Yin, Electrothermal study on resistive random access memory (RRAM) arrays, International Conference on Electromagnetics in Advanced Applications (ICEAA 2019), Granada, Spain, September 9-13, 2019

Qing-Hao Hu, Wen-Sheng Zhao, Gaofeng Wang, Da-Wei Wang, Potential applicability of single-walled carbon nanotube through-silicon vias for differential signal transmission, The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2019), Haining, China, October 21-23, 2019

Wen-Sheng Zhao, Qing-Hao Hu, Carbon nanotube through-silicon via: Modeling, design and applications, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2020), Shanghai, China, September 21-23, 2020

Li-Chao Fan, Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, A CSRR-loaded substrate integrated waveguide (SIW) sensor for full characterization of magneto-dielectric materials, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2020), Shanghai, China, September 21-23, 2020

Hong-Yi Gan, Li-Qun Li, Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, An improved differential CSRR-based sensor for characterizing the magneto-dielectric materials, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (IEEE NEMO 2020), Hangzhou, China, December 7-9, 2020

Qing-Hao Hu, Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, Circuit modeling of shielded differential carbon nanotube filled through-silicon vias, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (IEEE NEMO 2020), Hangzhou, China, December 7-9, 2020

Hao Xu, Wen-Sheng Zhao, Da-Wei Wang, Miniaturized microwave microfluidic sensor based on spoof localized surface plasmons, IEEE International Microwave Biomedical Conference (IEEE IMBioC 2022), Suzhou, China, May 16-18, 2022

Wei Ye, Wen-Sheng Zhao, Jing Wang, Da-Wei Wang, Gaofeng Wang, A split-ring resonator-based planar microwave sensor for microfluidic applications, IEEE International Microwave Biomedical Conference (IEEE IMBioC 2022), Suzhou, China, May 16-18, 2022

Zong-Feng Zhang, Jun Liu, Da-Wei Wang, Wen-Sheng Zhao, Nonlinear circuit model analysis of RF high-power transistor package shell, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2022), Harbin, China, August 12-15, 2022

Meng-Jiao Yuan, Da-Wei Wang, Wen-Sheng Zhao, Electrical modeling of on-chip spiral inductors based on graphene ribbons, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2022), Harbin, China, August 12-15, 2022

Ji Xu, Da-Wei Wang, Jun Liu, Guo-Dong Su, Wen-Sheng Zhao, Equivalent circuit model of strip line up to 110 GHz, Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC 2022), Beijing, China, September 1-4, 2022

Zeng-Cai Zhang, Da-Wei Wang, Wen-Sheng Zhao, A compact and narrow-band bandpass filter based on spoof surface plasmon polaritons, Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC 2022), Beijing, China, September 1-4, 2022

Jun-Chen Lv, Yi-Hao Ma, Wen-Sheng Zhao, Broadband absorptive common-mode filter based on H-shaped defect ground structure, IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), pp. 112-114, Harbin, China, July 15-18, 2023

Yu-Feng Xie, Yi-Hao Ma, Wen-Sheng Zhao, A single-notch ultra-wideband bandpass filter based on bow-tie cells, IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), pp. 112-114, Harbin, China, July 15-18, 2023

Guo-Sheng   Li, Chang-Sheng Mao, Wen-Sheng Zhao, Semi-supervised regression model for eye diagram estimation of high bandwidth memory (HBM) silicon interposer, International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China, August 15-18, 2023

Zhang-Zhe Feng, Yi-Hao Ma, Wen-Sheng Zhao, Design of quasi-absorptive ultra-wideband bandpass filter based on stub resonator, International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China, August 15-18, 2023

Yu-Bin Chen, Yi-Hao Ma, Da-Wei Wang, Wen-Sheng Zhao, An absorptive common-mode stripline filter for high-speed digital systems, International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China, August 15-18, 2023

Qi-Song Jiang, Lin-Yuan Chen, Da-Wei Wang, Wen-Sheng Zhao, A physics-circuit co-electrothermal simulation approach for PHEMT, International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China, August 15-18, 2023

Yifan Liu, Dawei Wang, Zhekang Dong, Wensheng Zhao, Compact model library in simscape for various memristors, International Applied Computational Electromagnetics Society Symposium (ACES-China), Hangzhou, China, August 15-18, 2023

Yi-Hao Ma, Wen-Sheng Zhao, Da-Wei Wang, Bin You, Jun Liu, and Lingling Sun, A resistor-free absorptive common-mode filter based on transmission space separation structure, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2024), Beijing, China, May 16-19, 2024

Jia-Hao Pan, Wen-Sheng Zhao, Da-Wei Wang, and Xiaoping Hu, Optimization of microwave microfluidic sensor based on deep reinforcement learning, International Conference on Microwave and Millimeter Wave Technology (ICMMT 2024), Beijing, China, May 16-19, 2024