Easy upgrade of the available designs for higher power output (Ic increase). Higher current density of TO-247PLUS-3 allows one-to-one replacement of 40 A IGBT with 75 A IGBT keeping the same footprint and thermal conditions. IFX internal lab test showed Pout increase of 40% replacing in B6 Drive topology 40 A IGBT in TO-247-3 with 75 A IGBT in TO-247PLUS.

Easy upgrade of the existing design for higher power is possible. With little re-design efforts, low R&D costs and fast re-design time. Improved system thermal management – Tj and Tc reduction (at same Ic)35% bigger backside thermal pad area of TO-247PLUS package results in 20% lower Rth of the package and contributes to 15% better heat dissipation. Replacing 40 A IGBT in TO-247-3 with same current 40 A IGBT but in TO-247PLUS package allows to reduce junction temperature Tj. Lower junction temperature Tj reduces thermal stress on IGBT, allows to use smaller heatsink or less powerful cooling fan leading to smaller system dimensions at lower BOM.

Maximize flexibility of your design with the TO-247PLUS package!