至今已出版专著一部，正式发表SCI论文270多篇，已授权国家发明专利200余项。

代表性著作与期刊论文:

[1] 冯雪，柔性电子技术，科学出版社

[2] Wang ZH, Shi NL, Zhang YC, Zheng N, Li HC, Jiao Y, Cheng JH, Wang YT, Zhang XQ, Chen Y, Chen YH, Wang HL, Xie T, Wang YJ, Ma YJ*, Gao XR*, Feng X*, “Conformal in-ear bioelectronics for visual and auditory brain-computer interfaces,” Nature Communications, 14: 4213, 2023.

[3] Chen XY, Jian W, Wang ZJ, Ai J, Kang Y, Sun PC, Wang ZH, Ma YJ, Wang HL, Chen Y*, Feng X*, “Wrap-like transfer printing for three-dimensional curvy electronics,” Science Advances, 9: eadi0357, 2023.

[4] Wang FL, Jin P, Feng YL, Fu J, Wang P, Liu X, Zhang YC, Ma YJ, Yang YY, Yang AM, Feng X*, “Flexible doppler ultrasound device for the monitoring of blood flow velocity”, Science advances, 7(44):eabi9283, 2021.

[5] Jin P, Fu J, Wang FL, Zhang YC, Wang P, Liu X, Jiao Y, Li HF, Chen Y, Ma YJ, Feng X*, “A flexible, stretchable system for simultaneous acoustic energy transfer and communication,” Science advances, 7: eabg2507, 2021.

[6] Chen SY, Lyu WH, Wang G, Chen Y, Ma YJ*, Feng X*, “Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing,” International Journal of Solids and Structures, 223: 111009, 2021.

[7] Liu X, Cao Y, Zheng KW, Zhang YC, Wang ZH, Chen YH, Chen Y, Ma YJ*, Feng X*, “Liquid droplet stamp transfer printing,” Advanced Functional Materials, 31: 2105407, 2021.

[8] Li HF, Wang P, Jiao Y, Jin P, Lu BW, Chen Y, Ma YJ*, Feng X*, “Mechanics of pressure driven transfer printing for stamp with micropillar,” Mechanics of Materials, 160: 103960, 2021.

[9] Xu JX, Fu CY, Fu QQ, Chen Y, Ma YJ*, Feng X*, “Flexible arc-armor inspired by origami,” International Journal of Mechanical Sciences, 201: 106463, 2021.

[10] Ma YJ, Zhang YC, Cai SS, Han ZY, Liu X, Wang FL, Cao Y, Wang ZH, Li HF, Chen YH, Feng X*, “Flexible hybrid electronics for digital healthcare,” Advanced Materials, 32: 1902062, 2020.

[11] Li HC, Ma YJ, Liang ZW, Wang ZH, Cao Y, Xu Y, Zhou H, Lu BW, Chen Y, Han ZY, Cai SS, Feng X*, “Wearable skin-like optoelectronic systems with suppression of motion artifact for cuff-less continuous blood pressure monitor,” National Science Review, 7: 849-862, 2020.

[12] Zhang YC, Zheng N, Cao Y, Wang FL, Wang P, Ma YJ, Lu BW, Hou GH, Fang ZZ, Liang ZW, Yue MK, Li Y, Chen Y, Fu J, Wu J, Xie T, Feng X*, “Climbing-inspired twining electrodes using shape memory for peripheral nerve stimulation and recording,” Science Advances, 5: eaaw1066, 2019.

[13] Zhang YC, Wu J, Ma YJ, Chen Y, Chen Y, Lu BW, Feng X*, “A finite deformation theory for the climbing habits and attachment of twining plants,” Journal of the Mechanics and Physics of Solids, 116: 171-184, 2018.

[14] Yue MK., Dong XL, Fang X and Feng X. Effect of interface reaction and diffusion on stress-oxidation coupling at high temperature. Journal of Applied Physics, 15: 123, 2018

[15] Chen YH, Lu SY, Zhang SS, Li Y, Qu Z, Chen Y, Lu BW, Wang XY, Feng X*, “Skin-like biosensor system via electrochemical channels for noninvasive blood glucose monitoring,” Science Advances, 3: e1701629, 2017.

[16] Su HH, Fang XF, Qu Z, Zhang C, Yan B and Feng X, Synchronous full-field measurement of temperature and deformation of C/SiC composite subjected to flame heating at high temperature. Experimental Mechanics, 56: 659-671, 2016.

[17] Wang YX, Chen Y, Li HC, Li XM, Chen H, Su HH, Lin Y, Xu Y, Song G F, Feng, X*, “Buckling-Based Method for Measuring the Strain-Photonic Coupling Effect of GaAs Nanoribbons,” ACS Nano, 10: 8199-8206, 2016.

[18] Dong X, Fang X, Feng X and Hwang KC. Diffusion and stress coupling effect during oxidation at high temperature. Journal of the American Ceramic Society, 96(1): 44-46, 2013

[19] Chen H, Feng X*, HuangY, Huang YG*, Rogers JA, “Experiments and Viscoelastic Analysis of Peel Test with Patterned Strips for Applications to Transfer Printing,” Journal of the Mechanics and Physics of Solids, 61: 1737–1752, 2013.

[20] Feng X, Meitl MA, Bowen AM, Huang YG*, Nuzzo RG, Rogers JA*, “Competing fracture in kinetically controlled transfer printing,” Langmuir, 23: 12555-12560, 2007.