Innovative top-side cooled SMD solution for high power applications

With the DDPAK package, Infineon Technologies introduced the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technologies 600V CoolMOS™ G7 superjunction (SJ) MOSFET, CFD7, S7 and CoolSiC™ Schottky diode 650V G6 are combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. With the latest QDPAK package, Infineon extends the top-side cooling offering even further. The QDPAK package is twice as big as the DDPAK and allows for usage in higher power applications. It is not only the perfect choice for SMPS applications but also offers benefits for static- and slow-switching applications and therefore is available also within CoolMOS™ S7 (addressing industrial applications) and S7A families (addressing automotive applications).