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1、伟创力校企合作项目培训伟创力校企合作项目培训课程名称：课程名称：PCBA制程工程技术概论制程工程技术概论 与基础与基础(PE+EE)编写部门：测试工程编写部门：测试工程Name :Khoo Tee WanDate :10 Jan 2010 2Contents内容内容PageObjectives目的目的Page-3Can you imagine world without electronics你能想象世界没有电子的情景吗？你能想象世界没有电子的情景吗？Page-4Electronics Industry Sectors电子工业部门电子工业部门Page-5Electronics Industry

2、 and SMT电子工业和自动粘贴技术电子工业和自动粘贴技术Page-6PCB Packaging Type PCB 封装方式封装方式Page-7Why mixed technology PCB packaging?为什么有混合的封装方式为什么有混合的封装方式Page-8SMT and Mixed Technology Assembly Types和多样的组装技术和多样的组装技术Page-9General Considerations for PCB Packaging封装考量通择封装考量通择Page-10Surface Mount Technology 表面粘贴技术表面粘贴技术Page-13

3、Overview of SMT Process SMT制程概述制程概述 Page-19Solder Printing锡锡膏印刷膏印刷Page-21Pick&Place Process选择选择和放置零件和放置零件Page-23Contents3Contents内容内容PagePost Reflow Process回流回流焊焊Page-28Wave Solder 波峰波峰焊焊Page-40Wave Solder and Through Hole Assembly Process 波峰焊和插件组装制程波峰焊和插件组装制程Page-44Contents4By the end of this modul

4、e,you will be able to:Describe electronics packaging and surface mount technology(SMT)Compare different assembly types Identify the different assembly processes for making the Printed Circuit Board (PCB)assembly Identify SMT components Objectives目的目的到本单元结束时，您将能够：描述电子产品包装和表面贴装技术（SMT）比较不同的装配类型识别不同的装配工

5、艺制造的印制电路板(PCB）组装SMT元件识别5Can you imagine a world without Electronics?你能想象世界没有电子的情景吗？你能想象世界没有电子的情景吗？6Electronics Industry Sectors 电子工业部门电子工业部门 计算机和商务设备计算器，电脑，复印机，服务器，等工业和医疗系统控制器。机器人，注入，听力，辅助，等消费电子盒式磁带录像机 摄像机 音箱耳机 游戏，等汽车娱乐安全气囊 防抱死制动系统 点火控制，等通信电子手机传呼机耳机网卡电子工业7What is Surface Mount Technology(SMT)?什么是表面贴

6、装技术（SMT）？A modern form of component and assembly process technology一种现代的元件和组装工艺技术 Used by electronics industry to manufacture Printed Circuit Board(PCB)assemblies用于电子工业的印刷电路板（PCB）组装Electronics Industry and SMT 电子工业和自动粘贴技术电子工业和自动粘贴技术8Also referred to asInsertion Mount Technology也被称也被称为为插入安装技插入安装技术术El

7、ectronic components are Inserted into holes in the PCB电电子元件插入到子元件插入到PCB的孔里的孔里Technology which is a Combination of SurfaceMount and Through Hole Technology这这是一种表面是一种表面贴贴装和通孔装和通孔技技术术的组合的组合Electronic componentsAre directly placed and Attached to the surface of the PCB.电电子元件，直接安置和子元件，直接安置和粘贴粘贴到到 PCB表面表面

8、PCB Assembly Types PCB 组装组装方式方式9 Unavailability of odd shaped,high power,and specialized components.奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。More investment required to setup a full SMT process 建立一个全套的SMT制程需要更多的投资。In many cases it is cheaper to use through hole components 插件元件在许多情况下是便宜的 THT is more robust and is

9、 necessary in certain applications 插件在某些应用中更可靠和必要Why mixed technology PCB assembly?为什么有混合为什么有混合PCB 组装技术组装技术10SMT and Mixed Technology Assembly TypesSMT和混合和混合组装组装技技术类术类型型 11Electrical Considerations电器考量电器考量PCB assembly density PCB组装密度Power requirements电源需求Power and signal distribution电源和信号分布Input/Out

10、put requirements输入输出需要Noise&Crosstalk between traces,pads,layers,etc.PCB 线路之间，焊盘之间,层与层之间的杂讯 和共鸣Hazardous voltage isolation 危险电压的隔绝Component selection 元件的选择Manufacturing Considerations生产的考量生产的考量Assembly type and component mix装配型号和元件的混合 Manufacturing process capability生产制程能力Board material 板材料Inter-pac

11、kage Spacing 元件脚间距Land pattern design and footprint orientation 焊环图案设计和器件封装方向Product volume产品量General Considerations for PCB assemblyPCB 组装的一般考量12Thermal Considerations热考量热考量Inter-package spacing元件脚间距Thermal expansion mismatch热膨胀系数不匹配Glass transition temperature玻璃化温度Processing temperatures加工温度Operat

12、ing conditions工作条件Thermal management requirements热管理要求Cost considerations成本考量成本考量 PCB cost PCB 成本 Material of the PCB物料成本 Number of layers PCB 层数 Trace width and space 线路宽度和空间 Via requirements 过孔要求 Special finish requirements 特殊表面处理要求 Component cost 元件成本 Assembly equipment cost 组装成本 Processing cost

13、工艺成本General Considerations for PCB AssemblyPCB 组装一般考量组装一般考量13Material Considerations物料考量物料考量Material properties材料特性Compatibility兼容性Application requirements运用需求Processing requirements工艺需求Cost成本Thermal,electrical and mechanical performance/properties 热，电气和机械性能/特性Other Considerations其他考量其他考量Design for

14、设计考量。Manufacture&Assembly 制造和组装Test测试Inspection检查Cost成本Procurement采购Service服务Environment环境Protection from environmental damage corrosion of contacts从预防环境损害和接触腐蚀Connection failures due to shock,vibration and flexing of PCBs 由于冲击，振动和弯曲的PCB造成的连接失败。Reliability of assembly 组装的可靠性Frictional wear of connec

15、tors连接器的摩擦磨损 Procurement and lead time采购和准备时间General Considerations for PCB assemblyPCB 组装的一般考量组装的一般考量14Why Surface Mount Technology?为什么有表面粘贴技术 Enables significant size and weight reduction可显着减少尺寸和重量Provides improvement in electrical performance改善电气性能Offers reasonable solution for high pin count ICs

16、 提供高引脚数集成电路合理的解决方案Manufacturing assembly is more easily automated生产装配更容易自动化Offers the potential for significant cost reductions提供了降低成本的巨大潜力Surface Mount Technology(SMT)表面粘贴技术表面粘贴技术(SMT)15Surface Mount Technology Performance 表面粘贴技术性能 Prime motivation is increased density and board area reduction。主要目的

17、是提高板密度和减少面积qSmaller devices(actives and passives)小体积的主动元件和被动元件qDIPs over 40 pins were impractical 超过40支脚的插件元件是不切实际的qTwo-sided mounting两面粘贴 SMT results in a better product SMT 可以生产出一个更好的产品qSame functions for less space 小的空间可以得到同样的功能qMore functions for same space同样的空间，跟多的功能qLess electrical signal dela

18、ys信号延迟少qLess mass,better vibration resistance更好的抗震性 In many cases SMT was required to make the product feasible 很多案例中,SMT 让产品成为可行Surface Mount Technology(SMT)表面粘贴技术(SMT)16 SMT-A modern form of component&assembly process technology,to manufacture PCB assemblies SMT，一个现代 PCB和元件组装工艺技术 Electronic compon

19、ents are directly placed and attached to the surface of the PCB 电子元件，直接安置和附着于印刷电路板的表面 Surface Mount Technology(SMT)表面粘贴技术(SMT)17 SMT Components SMT 元件Surface Mount Technology(SMT)表面粘贴技术(SMT)18Surface Mount Technology(SMT)表面粘贴技术(SMT)SMT ComponentsSMT 元件19Surface Mount Technology(SMT)SMT Assembly Type

20、s表面表面贴贴装装类类型型 Surface Mount actives or passives on one or both sides of the 主动主动性性和被动元件贴和被动元件贴装在装在PCB 的一面或双面的一面或双面 Applications运用qMost widely used where highest density is desired最广泛的使用于高密度板qTypically requires 4 layers minimum通常最少需要4层板qSpace Savings:Savings of up to 60-70%are attainable空间节省：可以实现高达60

21、-70是的节余20How are PCBs assembled?PCBA 怎样组装？怎样组装？WaveSolder波峰焊波峰焊Hand Placement手摆放手摆放VisualInspection目检目检ICT在线测试在线测试PCBPreparationPCB准备准备PCBA 测试测试Raw Component原始零件原始零件FT功能测试功能测试Overview of SMT Process SMT制程概述制程概述 SMT ProcessSMTSolder Printing锡膏印刷锡膏印刷Pick&Place选择和放置选择和放置零件零件Post Reflow回流焊回流焊21Solder Pr

22、inting 锡膏印刷锡膏印刷What is solder printing?什么是锡膏印刷 Process of transferring solder paste onto the pads of a PCB,by forcing it through mating apertures on a stencil,using a squeegee。用刮刀使用压力，使锡膏通过匹配的模具上的小孔，转移到PCB的焊盘的过程.22Circuit Board线路板线路板 Use to provide interconnect traces between components 提供元件间的相互连接St

23、encil钢板钢板 Vehicle by which the volume and placement location of solder paste deposition is controlled 控制锡膏流量和放置位置的媒介Solder Paste锡膏锡膏 Mixture of solder spheres and flux deposited onto pads of circuit board on a controlled volume.After reflow provides electrical,mechanical and thermal dissipative conn

24、ection between component and board 焊料和助焊剂的混合，定量的转化到线路板的焊盘上。经过回流，提供元件和线路板之间的电气，机械和热耗散连接Solder Printing 锡膏印刷锡膏印刷23Squeegee刮刀刮刀 Critical tool used to“push”paste through the designated openings.Variations in hardness,flatness,speed,angle and pressure critically impact quality of the print用于通过指定的开孔推动锡膏的关

25、键工具。硬度，平整度，速读，角度和压力 关键变量影响印刷的质量。Printer印刷机印刷机 Machine which deposits solder paste onto pads on the circuit board 将锡膏放到线路板上的机器Solder Printing 锡膏印刷锡膏印刷24Pick&Place Process 选择选择和放置零件和放置零件25 A flexible machine that places many different types of components on a PCB 灵活的机器，可以在一块PCB上放置许多不同类型的元件Most importa

26、nt piece of equipment in the SMT assembly process在SMT 组装制程中最重要的一种设备。Very expensive 很昂贵Without the use of appropriate feeders and a machine vision system,the placement equipment will not be able to pick&place components 如果没有适当的进料器和机器视觉系统的使用，安置设备将无法取放组件。It includes features such as:它包括以下的功能：q Reliable

27、 placement accuracy可靠的放置精度q Vacuum pickup capability真空提取能力q Automatic component realignment元件自动对准q Vision system视觉系统q Transportation system for PCBs PCBs 运输系统Pick&Place Process选择选择和放置零件和放置零件26 Factors influencing the use of automated placement equipment in SMT 在SMT 中影响自动贴装设备的使用的因素pHandling of compon

28、ents,especially small chips and ultra-fine pitch leaded devices 元件的手动搬运和操作，尤其是小芯片和超细间距引线的器件qThroughput requirements吞吐量需求qReliability and Accuracy可靠性和准确性qQuality质量qFlexibility灵活性Pick&Place Process 选择和放置零件选择和放置零件零件进料PCB 搬运育龄舰对准板办对准放置头机械手 机壳 27Pick&Place Process选择选择和放置零件和放置零件Normal Pick Up正常的提取正常的提取Z-A

29、xis moves till component is touched Z-轴移动直到接触到元件Then Z-Axis moves back and component is picked up，然后，Z-轴移回原来的地方，元件被提起来Touchless Pick Up 无接触的提取无接触的提取Z-Axis moves to a fixed height above the component Z-轴移动到元件上方一个固定的高度Component is sucked out of the pocket元件被吸出袋外28Post Reflow Process回流焊回流焊What is post

30、reflow process?什么是回流焊？Process of joining metallic surfaces through the mass heating of solder or solder paste是通过大量加热，使锡膏受热融化从而让表面贴装元器件和PCB焊盘通过焊锡膏合金可靠地结合在一起的制程。Creates a mechanical and electrical connection between the components and PCB 在PCB 和元件之间创建一种机械和电器的连接 Surface mount components are secured on

31、the surface and are dependent on solder volume for mechanical strength表面粘贴元件依靠一定量的锡膏由于机械强度被固定在表面Solder alloy metal is melted to form the connection合金焊料融化后，形成连接Liquid solder attaches to the base metals by forming intermetallic compounds,through the process of wetting液态焊料由金属间化和物，通过润湿流程附着在金属表面。29Post R

32、eflow Process回流焊回流焊Requirement for soldering 回流焊的需求q Source of Solder Alloy 焊料-合金q Source of Heat 热源q Flux 助焊剂q Compatible Metallization兼容金属q Clean Surfaces 表面清洁q Controlled Process被控制的流程30Post Reflow Process 回流焊回流焊 Surface Mount and Through Hole Solder Joints 表面焊接和通孔焊接表面焊接和通孔焊接31Post Reflow Process

33、回流焊回流焊 In the soldering process,three different heating methods are used 三种不同的加热模式用在焊接制程中。q Conduction热传导q Convention热对流q Infrared Radiation(IR)红外辐射Different heat transfer methods offer different advantages and disadvantages 不同的热传输模式有不同的优势和劣势32Conduction热传导热传导q Conduction occurs when two solid masse

34、s of different temperatures are in contact with each other热传导发生在不同温度下的两个固体相互的接触q Provides uniform product heating as heat will conduct from a hot spot to a cold spot in the product供给均匀的热，由于热能将从热的一端传到冷的一端。Post Reflow Process回流焊回流焊33Convection-热热对流对流 Convection heat transfer occurs when a fluid(such a

35、s air or nitrogen)flows over the object to be heated热对流发生在气体吹过目标物（如空气或氮气）。Two types-Natural Convection and Forced Convection两种方式-自然对流和强制性对流qNatural convection occurs when no flow is being forced over the object自然对流发生于没有气体被强制流过目标物。q Forced convection requires an external force that pushes or pulls th

36、e flow over the object强制对流需要一种外部的压力推动或拉动气流流过目标物。Most soldering ovens today use forced convection as the primary heat transfer method今天大多数焊接烤箱使用强制对流作为换热模式预热的主要方法Post Reflow Process回流焊回流焊34Infrared Radiation(IR)红外辐射q Infrared radiation(IR)occurs when two bodies of different temperatures are in sight o

37、f each other红外辐射发生与当两种不同温度的物体在相互的视野内q Heat is transferred by the electromagnetic waves generated by the hot body热被产生于热物体的电磁波转换。q Two important phenomenon with radiation:两种重要的辐射现象 Absorbtivity:Percentage of infrared absorbed by the PCB and components吸收：被PCB 和元件吸收的百分比 Black Body:A body that absorbs al

38、l radiation incident upon its surface黑体：吸收所有表面辐射的物体Post Reflow Process回流焊回流焊35Post Reflow Process回流焊回流焊q Soldering Surface Mount Components表面粘贴元件表面粘贴元件焊接焊接回流焊回流焊波峰焊波峰焊蒸气蒸气 红外辐射红外辐射强制对流强制对流36All the soldered connectsAre created in a single step所有的焊接在一个步骤完成The soldered connections areCreated one after

39、 another焊接在一个步骤接着另一个步骤地完成 Soldering Through Hole Components 插件元件插件元件Post Reflow Process回流焊回流焊插件元件插件元件一次性的一次性的连续性的连续性的37Post Reflow Process回流焊回流焊 Simultaneous Soldering一次性的一次性的浸焊浸焊 有防焊的波峰焊有防焊的波峰焊38Post Reflow Process回流焊回流焊 Sequential Soldering连续性的焊接连续性的焊接持续性焊接持续性焊接烙铁焊烙铁焊小热风焊小热风焊光波焊接光波焊接镭射焊接镭射焊接火焰焊接火焰

40、焊接39Post Reflow Process回流焊回流焊 Growth Trend增增长趋势长趋势40Wave Solder 波峰波峰焊焊Wave-solder machine module波峰焊机器模组 Conveyor传送带 Spray Fluxer助焊剂喷洒机 Preheat预热器 Solder Pot&Nozzles焊接棒 和焊嘴41Wave Solder 波峰波峰焊焊 Wave Solder Machine Layout 波峰焊机器分布进入喷洒助焊剂一区二区三区微波风刀冷却区输出风刀加热区-典型的强制热度对流层流波/振荡波42Wave Solder 波峰波峰焊焊波峰后的波峰后的PC

41、BA焊波焊波喷洒助焊剂喷洒助焊剂预热预热波峰焊波峰焊冷却冷却43Assembly Preparation for Wave Soldering波峰焊的准备波峰焊的准备 Fully automated or manual inspection of the assembly to verify:全部制动或手动目检oPresence or absence of various components元件的存在和缺件oComponent type and orientations元件型号和方向oDamaged boards撞板oBad component clinching on the bottom

42、 side底面的损件Selective solder masking using temporary liquid solder mask or tape,to prevent solder from attaching to specific are as of the PCB assembly 选择性焊锡屏蔽使用临时液态防焊或胶带，以防止焊料附着在PCB组装的指定的领域。Adding edge supports for the board,to prevent warping of thin boards 添加边缘支持，以防止薄板弯曲Wave Solder 波峰波峰焊焊44Wave Sol

43、der and Through Hole Assembly Process波峰焊和插件组装流程波峰焊和插件组装流程Is PCB of standard thickness?Add Board StiffnessFor thin boards增加板的刚度Yes(Standard Thickness=62-mils)标准厚度空板空板插件插件径向插入径向插入 多种方式插件多种方式插件运用临时防焊运用临时防焊PCB是标准厚度吗？是标准厚度吗？温度敏感元件的插入温度敏感元件的插入温度敏感元件的可选择性焊接温度敏感元件的可选择性焊接去除临时防焊物去除临时防焊物Inspection/Cleaning目检和清洁.No不是45Wave Solder and Through Hole Assembly Process波峰焊和插件流程波峰焊和插件流程46