1 QCOM 1.1 General Qualcomm: Quality Communications ALSA DCP：ALSA由DAI、Codec、Platform三部分组成 ALSA TLV：Type-Length-Value Alternative Mode: 替代模式 ANC：Automatic Noise Canceller ASM: Anntena Switch Module AT：ATtention Command ATCoP：AT Command Processor BHI: QFIL Boot human interface for PCIe bootloader DA：Download Agent，MSM的firehose就是DA，而PBL也叫做bootROM CAT M1: Category Minus 1 CCC：Common Command Codes，for I3C（Android 9.0 ADSP支持，类似于USB HSIC） CCGP：Windows USB Common Class Generic Parent，Linux内核类似的驱动就是usb_generic_driver CDT：Configuration Data Table CNN：Android中的ConnectivityService、NetworkPolicyManagerService、NetworkStatsService（数据统计）、NetworkManagementService（最底层，物理网络接口的管理服务，与netd通信） config_tether_upstream_types：Android手机配置为ApCli（AP-Client）时，作为Client的一方 config_tether_usb_regexs：regular expressions，正则表达式 CSP: Continue on Short Packet , DWC3 CV: Customer Visit DMIPS：Dhrystone Million Instructions executed Per Second，每秒执行百万条指令 DRI: Directly Responsible Individual，SSC Data Ready Interrupt DS：USB Data Service DSDA：Dual SIM Dual Active DSDS：Dual SIM Dual Standby DSR: Deferred Service Routine EDL: Emergency Download FFBM: Fast Factory Boot Mode FLCB: Fast Low Current Boot FLP：Fused Location Provider FSG: A Golden File System GDHS: Globally Distributed Head Switch (L2 cache) GENI: QUPv3 Generic Interface GLink：General Link，代替SMD的新机制 Gobi：Global Mobile Internet Technology，全球移动互联网技术，如MDM9x15等系列 HDET: High Power Detector HIDL：HAL Interface Definition Language，读作hide-l；/dev/vndbinder - vendor binder HKADC: Housekeeping ADC, 交互管理ADC HMD：The Home Of Nokia Phones HMSS: Hydra-Monaco SubSystem, qcom application processor HVDCP3: DPF_DMF values for Floating（non-drive mode）and DPR_DMR values for Removing the float of DP/DM lines. HVDCP-OPTI：High Voltage Dedicated Charging Port-OPTImization（QC3.0 and QC4.0 PPS） IAAD: EHCI Interrupt on Async Advance Doorbell IOA: Interrupt on ACK, USB IOC: Interrupt on Completion（DWC3）；Interrupt On Change（for PIC MCU） IOT: Interrupt on Token, USB ISP:  Image Signal Processor ISP: Interrupt-on Short Packet, DWC3 KBA: Knowledge Base Article LDPC：Low Density Parity Check，for 5G MBHC：MultiButton Headset Control mbn: Modem Configuration binary MDM: Mobile Data Modem MLME：Mac Layer Management Entity modemst: modem efs partition MSM: Mobile Station Modem MTC: Machine Type Communications NV：Nonvolatile Data OCMC: On-Chip Memory Controller PBL：Primary BootLoader PBM: Phonebook Manager PC: Parallel Charger (并联充电模组) PDC: Power Domain Controller PDU：Protocol Data Unit PMxxxx: xxxx PMIC Core PMIxxxx: xxxx PMIC Interface PMIC BCD：Bipolar CMOS DMOS PPID：Parent Process ID（Linux ps命令可以看到）；MFi Product Plan ID，例如 = 147312-0020，106455-0155 QAM8295P: Qualcomm Automotive infotainment Module QCA: Qualcomm Atheros QCCI：QMI Common Client Interface QCMAP: Qualcomm Mobile Access Point Service QCPE: QualComm TZ Protected Element QCSI：QMI Common Service Interface QDSP：Qualcomm Digital Signal Processor QFE: Qualcomm Front-end QHEE：QCOM Hypervisor Execution Environment QMI：Qualcomm MSM Interface QMI_PDS：QMI Position Determination Service - for GPS QPNP: Qualcomm Plug and Play QSC: Qualcomm Single Chip QSD: Qualcomm Snapdragon QTI SLPI GPIO: sensor low power interface, SSC GPIO RBCO：Rock Bottom Current Optimization，底电流调试 RDM：Runtime Device Mapper REX：Real-time Executive OS RMA: Return Material Authorization RFFE: Radio Frequency Front-end RTR: Radio Transceiver S801: MSM8974AA SAM: Sensors Algorithm Manager SBL：Secondary BootLoader SBZ：Should Be Zero SCHG: Switching charger SDU：Sensor Data Unit SEE: Sensors Execution Environment SIO：Serial Input and Output，对各种串行接口数据的预处理（SDIO/UART/USB） SLPI: Sensor Low Power Island SMD：Shared Memory Device SNOC：System Network On Chip Socket BLA：bind()、listen()、accept() SRLTE: Simultaneous Radio and LTE SSC: Snapdragon Sensors Core, used by aDSP SSR：SubSystem Restart SSUSB-QMP：QCOM Multiple Protocol Phy SURF: Subscriber Unit Reference Platform TCSR: Top Control and Status Register TE：Terminal Equipment ThreadX: X means context switching Tilt Sensor：抬手亮屏传感器，另外一个Wrist Sensor（检测翻腕动作），与Tilt差不多 TLMM: GPIO Top Level Mode Multiplexer ttyAMA: ARM AMBA PL011, for QNX Hypervisor ttyHSL: tty High Speed Serial Lite ttySAC: tty Special Administrator Control UniPro: Universal Protocol USAM: Universal SSC Algorithm Module，ADSP SSC算法模块 WCD: wafer codec/decode WCN: wireless connectivity network WTR: Wafer Transceiver XBL：Extended BootLoader XPU: Embedded Memory Protected Unit 1.2 SoC APQ: Application Processor Qualcomm MPQ: Media Processor Qualcomm SDA：Snapdragon Auto（汽车APQ） SDAm：汽车MSM Snapdragon Mobile (SDM) = MSM Snapdragon Modem（SDX）= MDM Snapdragon Mobile (Compute) (SDA) = APQ Snapdragon Mobile (Compute) (SDC) = MSM SDW：Snapdragon Wear SDW1100 = MDM9207-1 SDW1200 = 取MDM9206的Modem和Snapdragon Wear 1100/2100的AP SDW2100 = MSM8909w 1.3 DSP NPU: qcom Neural Process Unit, DSP and CM3 aDSP: qcom audio DSP cDSP: qcom compute DSP mDSP: qcom modem DSP sDSP: qcom sensor DSP, SLPI 1.4 Platforms ADP：Automotive Development Platform CDP：Core Development Platform FFA: Form Factor Accurate FLUID：Forward Looking User Interface Device LiQUID：Large Qualcomm User Interface Device MTP：Modem Test Platform QRD SKU：Qualcomm Reference Design Skull SURF: Subscriber Unit Reference Platform 1.5 MSM软件成熟度 FC：Feature Completed ES：Engineering Sample CS：Commercial Sample 1.6 QMI DMS: Device Management Service NAS: Network Access Service UIM: User Identity Module WDS: Wireless Data Service 2 Charge 2.1 Misc OPPO VOOC：Voltage Open-Looped, Multi-Step Constant-Current Charging，电压开环，多步恒流充电 2.2 MTK Charge BATSNS：充电电流检测电阻的负极 BAT：电池正极引脚 BAT_ON：电池NTC (热敏电阻) 引脚 CAR：库仑计 Cmax/Qmax：电池容量 DOD：Depth of Discharging，放电深度百分比 ept：MTK Easy PinMux Tool IPO: MTK Instant Power On ISENSE：充电电流检测电阻的正极 mAh：放电容量 OCV：Open Circuit Voltage，开路电压 RECHARGING_VOLTAGE: 回充电压 R (battery)：电池内阻，(V2-V1)/400mA SOP: Standard Operation Procedure，操作指导 VC (=VBAT)：Voltage of Closed Circuit，闭路电压，Charge ADC采样的到电压就是闭路电压 VCHG：USB正极 VCDT：VCHG Charger Detect充电电压检测脚 ZCV：（Zero Current） Voltage，零电流-电压，一般指ZCV的2个表格（开路电压-放电深度百分比，开路电压-电池内阻） 3 Display and Camera 3.1 General 3A：自动对焦（AF）、自动曝光（AE）、自动白平衡（AWB） CSI：Camera Serial Interface DSI：Display Serial Interface EOS：Electro Optical System，佳能电子光学系统 EVS：Exterior View System，Android车载系统Camera架构HAL层（不同于手机Camera架构） FPC指纹：FingerPrint Cards AB FPD：Flat Plane Display GMSL：Gigabit Multimedia Serial Link HPD：HotPlug Detection NTxxxx屏幕：联咏科技novatek TNT显示器：Touch & Talk 3.2 ADAS摄像头种类 ADAS：Advanced Driver Assistance System，先进驾驶辅助系统，Bosch提供整个方案模块 ADASIS：Advanced Driver Assistant Systems Interface Specifications，EHP规范 AVM：Around View Monior，360°环视摄像头 DMS：Driver Monitoring System，疲劳驾驶监控，使用GHS INTEGRITY RTOS系统，通过车载以太网通信（PHY工作在Master模式，连接时，会主动和Slave PHY进行链路训练），法国Valeo提供方案 DVR：Digital Video Recorder，行车记录仪 HAP: GWM Highly Automatic Parking IRK: BMW Innenraumkamera, interior camera OMS: Occupancy Monitoring System RVC：Rear View Camera，倒车影像 SVC：Side View Camera，盲区摄像头 UCAP: BMW UltraSonics Camera Automated Parking, including EAVB AVM VIMS: GWM Video Intelligent Monitor System with EAVB supported 3.3 touch FTS touch: Focaltech Systems 4 GNSS C/A码：Coarse / Acquisition Code，粗码 CNR：Carrier Noise Ratio EPO: Extended Prediction Orbit GGA: Global Positioning System Fix Data，定位信息 GLL: Geographic Position, Latitude/Longitude，地位地理信息 GNRMC：Global Navigation Recommended Minimum sentence C，多模推荐定位信息 GPRMC：GPS Recommended Minimum sentence C，GPS推荐定位信息 GSA: GPS DOP and Active Satellites，当前卫星信息 GSV: GPS Satellites in View，可見卫星信息 NAV-DOP：Dilution of Precision，精度因子，U-BLOX的私有的UBX消息包 NAV-PVT：Position Velocity and Time（UTC），U-BLOX的私有的UBX消息包；fixType表示定位有没有成功标志字段，velN表示NED north velocity P码：Precise Code，精码 QMI_PDS：QMI Position Determination Service - for GPS RMC: Recommend Minimum Specific GPS/TRANSIT Data，推荐定位信息 RTCM：Radio Technical Commission for Maritime services，海事无线电技术委员会 VTG: Track Made Good and Ground Speed，地面速度信息 ZDA: Time & Date，时间日期信息 5 GPU Adreno：名字改自于Radeon Falcon：FAst Logic CONtroller。NVIDIA私有的RISC MCU，主要用在桌面GPU（Falcon中的寄存器一般映射到PCI BAR0）或者Tegra xHCI控制器中。NVIDIA正在把私有的Falcon MCU架构换成RISC-V GC7000: Vivante GC (Graphics and Compute), used by iMX 6 and iMX 8 GeForce：Geometry Force，几何威力 GTX显卡：Grand Touring eXtreme IMG AXT-64-2048：Imagination Technologies；A表示AI，A系列的意思；XT表示eXTreme LE：Low Edition，低端版 Mali：Maliak，在克罗地亚语中的含义是small RTX显卡：Ray Tracing eXtreme TI：Titanium 钛 Voodoo：这个起源于南美古老而又神秘的宗教，巫毒教 6 MCU and SOC 6.1 ARC ARC：Synopsys Argonaut RISC Core ARC EM5D：Synopsys ARC Embedded 5 DSP ARC EM SEP：Synopsys ARC Embedded Safety-Enhanced Processor ARC HS：Synopsys ARC High-Speed 6.2 Automotive AURIX: Infineon Automotive Realtime Integrated NeXt Generation Architecture TC265: Infineon TriCore (Triple Core), RISC/MCU/DSP XMC: Infineon Cross Market Microcontroller, based on ARM Cortex-M ITMON: Samsung EA9 IPs Traffic Monitor, 36bit physical memory address bus S2MPU: Samsung EA9 Stage-2 Memory Protection Unit vGEN: Samsung EA9 Hypervisor VID Generator 6.3 CE ABOV：AP（Application Processor）Division of Magnachip Semiconductor，韩国现代单片机 AT91SAM9260：SAM means Smart ARM-based Microcontroller ATMEL SAMBA：ATMEL Smart ARM-based Microcontroller Boot Assistant CC2540：ChipCon CHKS009：鑫汇科电磁炉MCU ED：Engineering Debug EFM32：Silicon Labs, Energy Friendly Microcontroller ICC：Integrated Cockpit Controller IOC：Input Output Controller，车机MCU LPC：NXP, Low Power Consumption Marvell SoC ARMADA：（西班牙的）无敌舰队 MCS-51：Micro Computer System Microchip PIC：Programmable Interface Controller MSP：TI, Mixed Signal Processor OTA：Running change PSoC：发音p sock，Seattle Cypress Microsystems Inc, acquired by Cypress Semiconductor Corporation, http://blog.chinaaet.com/fy_zhu/p/31978 PXA：Xscale Application Processor RA：Renesas Advanced RX：Renesas eXtreme RH850：Renesas High-performance RISC-V：读作risk-five，表示为第5代RISC STC：SysTem Chip Tegra K1：K means Kepler Tegra X1：X means Maxwell，Drive CX（Cockpit Maxwell），Drive PX（Auto-Pilot Maxwell） Workaround：确定现象，找不到root cause，但是可以解决；与rework的意思大概相同（可能印度人用的多） 6.4 DSP CEVA公司：塞瓦定理，是由意大利几何学家Giovanni Ceva发现，用来证明共点线的一个几何原理，通常称为汇集定理。当今将各种技术汇集在单个产品之上正是半导体工业大势所趋，以塞瓦定理命名的CEVA公司也正是秉承这一理念才走到了今天。 7 Misc CoAP：The Constrained Application Protocol MFF：eSIM M2M form factors RCA：Root Cause Analysis RMA：Return Materials Authorization，芯片失效测试，一般是指公司内部的退货流程，假设一公司售出某物品, 因为品质问题或出错货，客户要求退货，公司经过与客户沟通后，确认客户可以退货 SOP：Standard Operation Procedure，操作指导 SOP：Start Of Production，开始量产 8 NXP/Freescale 74HC04D：High CMOS，最后一个D表示封装形式 HCS08：Freescale High-speed CMOS Speedup，简写为S08 iMX287: integrates the first generation FEC and MorethanIP L2 switch, MorethanIP GmbH was acquired by Synopsys in 2021 ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054 MC i.MX6Q：（Motorola Advanced Computer System on Silicon）innovative Multimedia eXtended 6 Quad Core；最早由SigmaTel创立 Motorola：Motor表示汽车，ola表示声音，合起来，就是汽车之声 MQX RTOS：Message Queue eXecutive NE555: 555 Timer IC. Made by Signetics which is Signal Network Electronics, hence NE is Network Electronics NPU: iMX 8M Plus integrates Vivante VIP8000 NPU PowerPC：Performance Optimization With Enhanced RISC – Performance Computing；the "PPC" prefix is IBM terminology；Motorola uses the mnemonic "MPC" instead S32: NXP scalable SBC：Single Board Computer SJA1000：Stand-alone CAN controller，C51并行接口 TFA：Terminal For Amplifier TJA1050：Transceiver，High-speed CAN transceiver UJA1164：Mini high-speed CAN System Basis Chip（SBC）transceiver， SPI接口 How to find NXP PNI? search "NXP Product Numbering Information" 9 Sensor 9.1 General HRV：Heart Rate Variability（心率变异性），光电心率没有办法检测HRV数据的，需要ECG才可以测量；心率变异性(HRV)特指心跳时间间隔的微小变化。心率变异性变化越大，表明自主神经系统对身体协调作用越好、身体具备更多的活力。测量心率变异性(HRV)可以直观反映一个人的身体健康状况，并且也能够判断目前的训练方式对改善身体状态是否有效。 PDR：Pedestrian Dead Reckoning，室内定位(计算相对位置的定位方法)，PDR定位是一种基于传感器信息计算相对位置的定位方法，首先通过加速度传感器检测行人的步数并计算出步长，然后通过磁阻传感器和陀螺仪计算出行人的航向角，最后获取人体移动的相对位置从而实现定位。相较于其他室内定位方法，PDR不受外界环境影响，定位精度较高，但只能获取相对位置信息且存在累积误差。 PPG：photoplethysmography，光电心率传感器，Apple Watch用的就是这种。 9.2 Bosch BHI160B：Bosch Sensor Hub with MEMS IMU 160B BMA355：Bosch 3-Axis MEMS Accelerometer 355 BMI160：Bosch 6-Axis MEMS IMU 160 9.3 ST AIS328DQ：Automotive Inertial Sensor - 3 axes - 2/4/8g full scale - Digital Output - QFPN package A3G4250D：Automotive - 3 axes - Gyroscope - 4x4 LGA 16L - 245dps full scale - Digital Output LIS3DH：Linear Inertial Sensor - Digital Output - High Level LPS001DL：Linear Pressure Sensor - Digital Output - Low Level LSM303DLH：Linear Sensor Module - Digital Output - High Level 10 TI AM335x：ARM MPU，可以运行Linux的才叫MPU，否则叫MCU，用于工控 BB: Burr Brown, co-founded by Robert Page Burr and Thomas R.Brown Jr., PCM1972. Acquired by TI BQ：Benchmarq CC2530：TI ChipCon2530 DRA746：DRAgon，Jacinto，名字来源于德州仪器汽车电子处理器美国办公室旁边的一条河 LM117 / LM317: W117 / W317, Fundamentals of Analog Electronic. The LM in the part number stands for Linear Monolithic (线性单片电路), which National Semiconductor used to describe many of their analog ICs LM555: 555 Timer IC. The LM in the part number stands for Linear Monolithic, which National Semiconductor used to describe many of their analog ICs McBSP：Multichannel Buffered Serial Port TDA：TI Driver Assistance TIP110: Texas Instruments Power TLC：Texas Instruments Linear CMOS TLV：TI Low Value，高性价比 TMS：Texas Manufactured Semiconductors TMX：Texas Manufactured Experimental Device TPS：TI Performance Solution 11 USB ACP：iPod Authentication CoProcessor，IC mfi337s3959 iAP2：iPhone CarPlay iOS Accessory Protocol, Version 2，iAP2分为3层，分别是传输层、链路层、会话层；而iAP1没有分层的概念 ARC：Argonant RISC Core ATS：Accessory Test System，iPhone Carplay自测试 CCG2：Type-C Controller Generation 2 CCG3PA：Type-C Controller Generation 3 Power Application CCGP：Windows USB Common Class Generic Parent，Linux内核类似的驱动就是usb_generic_driver CMG1：USB Type-C EMCA Controller Generation 1 DP：Dual Port，或者Display Port DWC2/DWC3：Design Ware Controller，Apple的嵌入式设备，包括iPad和iPhone都是使用的DWC2 EZ-USB：Easy AnchorChips FTDI：Future Technology Devices International giveback：归还 - ehci_urb_done() -> usb_hcd_giveback_urb()。USB PD中的giveback（= 1）指sink会响应source的GotoMin请求，返还部分电力给source。 GRL：Granite River Labs ，美国工程测试认证实验室 HX3C：Cypress USB Type-C Hub with PD IAAD：EHCI Interrupt on Async Advance Doorbell iPhone XR：R means Regular ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054 MDATA：More DATA，USB双缓冲（ep_kind配置使能）切换机制对应到DATA0和DATA1 MTK BICR：Built-in CDROM NEC uPA, uPB, uPC, uPD：uP：微型产品（micro Product），A代表Analog（混合元件），B代表bipolar（双极数字电路），C代表双极模拟电路，D代表单极型数字电路 PDI1394L40BE，PDIUSBD12：TODO PTN5100：Part Number Quirks：the attributes of a device that are considered to be noncompliant with expected operation RNDIS OID：Object Identifier RNDIS wceis：Windows CE Internet Sharging，（WceIsVista.INF -- This is the inf installation script for RNDIS-over-USB host driver for Intenet Sharing device.） Renesas名字由来：Renaissance Semiconductor for Advanced Solutions SL811HS：Cypress/ScanLogic 811 Host/Slave，性能上与ISP1161（Integrated host Solution Pairs 1161）相当 SPH：USB Single-Port Host SSUSB-QMP：QCOM Multiple Protocol Phy TDI：TransDimension Inc.，该公司首先发明了将TT集成到EHCI RootHub中的方法，这样对于嵌入式系统来说，就省去了OHCI/UHCI的硬件，同时降低了成本，作为对该公司的纪念，Linux内核定义了宏ehci_is_TDI(ehci)；产品UHC124表示USB Host Controller；收购了ARC USB技术；现已被chipidea收购，chipidea又被mips收购 TT：Transaction Translator（事务转换器，将USB2.0的包转换成USB1.1的包） µAB：Micro AB USB BH reset：Bigger Hammer or Brad Hosler，表示warm reset；you may be confused why the USB 3.0 spec calls the same type of reset "warm reset" in some places and "BH reset" in other places. "BH" reset is supposed to stand for "Big Hammer" reset, but it also stands for "Brad Hosler". Brad died shortly after the USB 3.0 bus specification was started, and they decided to name the reset after him. The suggestion was made shortly before the spec was finalized, so the wording is a bit inconsistent. USB3 BULK Stream ID：对应到SCSI Tag或者SATA Tag USB KVM：KVM是键盘(Keyboard)、显示器(Video)、鼠标(Mouse)的缩写；KVM端口是25-pin，包含VGA接口和USB接口 uSOF：micro Start of Frame，125us VIL：wValue，wIndex，wLength WinPE：Windows Preinstallation Environment 12 x86 ABL：Automotive BootLoader，是UEFI的一部分，ABL负责启动bootloader（= kernelflinger），kernelflinger启动boot.img Android LTS：Long Term Support Android MR1：Maintenance Release ELK：Emergency Linux Kernel GR_MRB：Gordon Peak Modular Reference Board HECI：Host Embedded Controller Interface，Host OS和x86 ME的通信接口，只有4pin，分别是REQ#、GNT#、TX和RX，目的是为了代替SMBus IFWI：Intel Proprietary Integrated Firmware Image Intel BXT：Broxton MEI：Intel Management Engine Interface；一个独立的子系统，使用ARC处理器，OS是Minix 3，固件整合到BIOS中，通过PCI桥片在x86端访问ARC的local端 MPH：USB Multi-Port Host，Intel APL (Gen9, A39X0) 8-port MPH xHCI的Port1作为OTG使用，和DWC3（仅作为slave）使用一个MUX开关来控制Host还是UDC连接到该Port1 TOS：Trusted OS，类似于ARM的TZ vbmeta：Verified Boot Meta Image Partition