AMD Ryzen R9

2023-07-13 16:20| 来源: 网络整理| 查看: 265

在稍早 AMD 的 Ryzen 3000 系列處理器正式解禁性能測試，此次 AMD 也提供其中的 Ryzen R9-3900X 與 Ryzen R7-3700X 、 Radeon RX5700 、 Radeon RX5700XT ，以及技嘉、華擎的 X570 主機板、技嘉 AORUS PCIe 4.0 SSD 、芝奇的 DDR4 3600 記憶體等供測試，而在稍早台灣的報價也已經出爐，消費者可藉測試數據評估此次 AMD 的戰力。

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▲此次取得的平台是 Ryzen 9 3900X 與 Ryzen 7 3700X

此篇將以 Ryzen R9-3900X 與 Ryzen R7-3700X 兩款處理器為主，這也是第一波產品當中最多核心、以及 65W TDP 最高規格的兩款處理器，由於作業上時間的限制，將以同樣搭配 Radeon RX5700XT GPU 、同樣的芝奇記憶體、金士頓 M.2 PCIe SSD 為條件進行評測， CPU 電源僅連接 8Pin ，使用盒裝散熱器、不進行超頻，僅開啟 XMP 2.0 做為限制。

Ryzen 9 專屬精緻包裝

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▲ Ryzen 9 系列的包裝採用新設計

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▲珠寶盒型的硬紙盒與軟紙盒質感高下立判

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▲ Ryzen 9 3900X 包裝質感比起 Ryzen 7 3700X 好很多

可看到 Ryzen R9-3900X 系列採用新設計的硬式盒裝，宛若鐘錶盒的設計，與原本 Ryzen 系列軟紙盒搭配瓦楞紙固定風扇、 CPU 硬盒的設計相較下顯得更有質感，不過內容物基本上還是一樣的，包括處理器與 AMD 原廠的 Wraith Prism 幽靈扇，值得一提的是 AMD 此次應該對台積電 7nm 製程信心十足，即便是 TDP 105W 的 Ryzen R9-3900X 仍大膽的附上 Wraith Prism 幽靈扇。

Wraith MAX 藉熱導管直接接觸提升散熱性能

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▲ Wraith Prism 風扇採用透明、運作時比起 Wraith MAX 更浮誇

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▲ Wraith Prism 仍維持四根熱導管與銅底設計

Wraith Prism 雖與原本的 Wraith MAX 外觀近似，也同樣採用 4 熱導管，乍看下僅有將風扇由黑色改為透明，然而底部熱導管接觸的設計是兩款散熱器最大的差異，也是奠定 Wraith Prism 盒裝旗艦散熱器地位的關鍵。當然透明風扇的 Wraith Prism 也比起僅有導光環的 Wraith MAX 更浮誇，不過兩者都同樣可藉 USB 介面或是主機板的 RGB 同步控制燈效。

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▲ Wraith Prism 的四根銅導管直接與 CPU 上蓋接觸

Wraith MAX 的四根導管最終是安插在一塊平整的銅底上，而 Wraith Prism 為了進一步提升散熱效率，直接把四根銅導管輾平，使銅導管直接與 CPU 上蓋接觸，不過要留意的是也由於銅導管之間有些許間隙，容易造成安裝時若未一次到位重複安裝導致散熱高不均勻，故一旦裝機發現風扇轉速偏高或是效能有些許差異，建議直接卸下散熱器重塗散熱膏。

技嘉 X570 AORUS MASTER 、華擎 X570 Taichi 雙平台

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▲此次取得的組合是技嘉 AOROS 的 X570 AORUS MASTER 以及華擎的 X570 Taichi

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▲此次兩張主機板都屬於技嘉與華擎第二階等級

至於此次 AMD 提供的主機板為技嘉 AOROS 的 X570 AORUS MASTER 以及華擎的 X570 Taichi ，由於時間問題，筆者此次以 X570 AORUS MASTER 搭配 R9-3900X 、華擎 X570 Taichi 搭配 R7-3700X ，不過在拍攝完產品照後，華擎通知要更換主機板為正式版本，故照片為工程版、測試時為正式版，但以照片而言除運作時正式版 RGB 光效外難以區分差異。

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▲ X570 Taichi 機背有著抗彎曲與抗訊號干擾的金屬背板

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▲ X570 Taichi 電供散熱片為熱導管搭配鋁質散熱片

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▲ X570 Taichi 音效區塊也採獨立區塊，搭配音響級電容

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▲ X570 Taichi CPU 供電採用 8+4 Pin

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▲ X570 Taichi 背面可快速清除 CMOS ，保有一個 HDMI 輸出

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▲ X570 Taichi 散熱片的齒輪造型為點綴、風扇在齒輪上方的網罩下

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▲ X570 Taichi 的三條 M.2 散熱片採用大型化設計，散熱片同時兼具晶片組風扇遮罩

兩張中高階的主機板都有相當精緻的設計，也具備 LED 狀態燈與快捷開關，就不需要拿螺絲起子去觸發開關； X570 AORUS MASTER 的 M.2 PCIe 散熱片為每個插槽獨立， X570 Taichi 則採用一塊大型的散熱片覆蓋，且同時裝有光效與兼具晶片組風扇的遮罩，搭配時建議不要搭配裝有不可拆卸散熱片的 SSD ，否則就只能犧牲散熱片護罩以及讓晶片風扇裸奔。

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▲ X570 AORUS MASTER 供電散熱片採用熱導管搭配鰭片， CPU 電源可輸入 8+8 Pin

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▲ X570 AORUS MASTER 的 SATA 為轉 90 度設計、提供六個 SATA

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▲ X570 AORUS MASTER 的三條 M.2 SSD 散熱片採獨立設計

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▲ X570 AORUS MASTER 板上有開關、而 Reset 為微動開關

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▲ X570 AORUS MASTER 搭配 ESS SABRE 音效晶片

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▲ X570 AORUS MASTER 的晶片有主動散熱

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▲ X570 AORUS MASTER 背面有著大型遮罩可防止變形與其它訊號干擾

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▲ X570 AORUS MASTER 主機板後方具備 CMOS 清除與快速進行韌體更新的按鍵、但無視訊 IO

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▲ X570 AORUS MASTER 音效部分甚至有 WIMA 薄膜電容

供電部分， X570 AORUS MASTER 的 CPU 採用 8+8 Pin ，而 X470 Taichi 則是採用 8+4 Pin ，不過由於筆者手邊的電源供應器形式較舊，僅有單一路 8Pin CPU ，加上都是搭配幽靈扇，故此次測試兩者皆統一使用 8Pin 供電；另外兩者的音效線路都有隔離與音響遮罩，其中搭配 ESS 音效晶片的 X570 AORUS MASTER 還可看到裝有音響級的 WIMA 薄膜電容。

AORUS PCIe 4.0 SSD 、芝奇幻光戟 DDR4 3600MHz 備戰

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▲ 不太確定此次拿到的包裝為市售盒裝或是媒體測試用包裝

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▲芝奇幻光戟的設計並未走電競圈流行的科技感，而是採用相當浮誇的珠寶風

為了發揮 AMD Ryzen 3000 平台的水準， AMD 還準備了 AORUS PCIe 4.0 SSD 2TB ，以及芝奇頂級的幻光戟 DDR4 3600MHz 記憶體；為了保有使用彈性， AORUS PCIe 4.0 SSD 2TB 的銅散熱片是讓消費者可拆裝的設計，避免由於部分主機板設計導致無法(例如此次搭載大型一體式遮罩的 X570 Taichi ...)，另外可看到主控為群聯的 IC 。

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▲可看到群聯的主控晶片

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▲ AORUS PCIe 4.0 SSD 的銅散熱片需要自行鎖上

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▲此次搭配的 SSD 與 RAM 都相當浮誇

至於芝奇的幻光戟配有非常驚人的電鍍金色散熱片，以及浮誇的仿鑽石(或是水晶？)顆粒的 LED 導光，與競品為迎合時下追求電競的高階記憶體的科技感設計大為不同，幻光戟給人一種浮誇與奢華的特色，若就視覺搭配與有著類似 CyberPunk 蒸氣龐克風的 X470 Taichi 似乎較為一致。

Ryzen 3000 採用改良架構、性能更高的 Zen 2

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▲ Ryzen 3000 採用改良式的 Zen 2 架構

回到此次的兩款處理器部分，此次 AMD 再度打破消費性平台的核心數量，此次 Ryzen 9-3900X 已達 12 核心、年末的 Ryzen 9-3950X 更高達 16 核心，甚至影響到自身 Threadripper 系列較低階的產品線，當然 Threadripper 本身仍對記憶體通道保有優勢，不過別忘了 Ryzen 3000 已經是改良型的 ZEN 2 核心架構，同時還具備 PCIe 4.0 通道。

此次提供的 Ryzen 9-3900X 為 12 核心、 24 執行緒的猛獸，而 Ryzen 7-3700X 也是一款具備 8 核心、 16 執行緒且僅 65W TDP 的產品；當然光是核心數量升級是不夠的， Ryzen 3000 系列的 Zen 2 架構還改善 15% 的 IPC uplift ，與較 Zen+ 加大一倍快取，還有提升兩倍浮點運算性能，加上台積電 7nm 製程帶來更高的時脈，助其更能與 Intel 平台抗衡。

低發熱、高性能是 Ryzen 3000 最明顯優勢

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▲ Ryzen 9 3900X 也同樣搭配 Wraith Prism 散熱器

最難能可貴的是，雖然 Ryzen 9-3900X 與 Ryzen 7-3700X 是相當高性能的處理器，然而在不超頻的前提下，仍能搭配盒裝的 Wraith Prism 散熱器保有最高約 75 度的運作溫度，至於 Ryzen 7-3700X 也差不多控制在這樣的水準，對於不打算超頻直接使用的消費者也可說省下添購散熱器的預算。

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▲拜 7nm 製程，僅採用四熱導管的下吹式 Wraith Prism 散熱器仍可壓制此次測試的處理器

由於 Ryzen 9-3900X 是 105W TDP 與 12 核心的怪物，無論是裝在 X570 AORUS MASTER 或是 X570 Taichi ，風扇轉速都有偏高的跡象，同時比較下技嘉的溫度控制更為保守，溫度提升後風扇的轉速攀升相對更快一些；至於 Ryzen 7-3700X 則在兩個平台全速時風扇噪音仍就不大，基本上也不用擔心過於吵雜的狀況。

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▲ Ryzen 7 3700X 包裝為原本的設計，同樣配有 Wraith Prism

如果考慮的是連續運作的穩定與降低噪音，筆者仍建議選擇 Ryzen 9-3900X 的消費者考慮額外投資一顆散熱器，至少筆者把 Wraith Prism 更換成 Thermalright 的 AXP-200R 後就沒有明顯的噪音，至於 Ryzen 7-3700X 就不一定要額外投資散熱器，如此一來至少相對 Intel K 系列必須自購一定等級散熱器的情形可省下不少花費。

單核表現趨近對手、多核輾壓接近價位帶對手

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▲ Ryzen 9-3900X 多核表現甚至不遜於 TR 1950X

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▲ Ryzen 9 @ PCMark

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▲ Ryzen 9 @ PCMark 10 Extended

這次 Ryzen 3000 系列的表現確實相當亮眼，雖在單核心部分並未完全壓制 Intel 的 i9-9900K ，不過也相當接近 Intel 第九代平台的表現，而以相同價格考量，多核心部分，以價格為基準， Ryzen 9-3900X 毫無懸念的壓倒 8 核心的 i9-9900K ，而 Ryzen 7-3700X 也相當逼近 i9-9900K 多核的表現。

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▲ Ryzen 7 表現也不至於與 i9-9900K 落差太大

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▲ Ryzen 7 3700X 較 Ryzen 7 1700X 大幅改善多核心性能

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▲ Ryzen 7 3700X @ PCMark 10

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▲ Ryzen 7 3700X @ PCMark 10 Extended

但更重要的是 Ryzen 9-3900X 在 Cinebench R20 的測試數據，甚至有機會超越 16 核心的 Ryzen Threadripper 1950X (筆者測試幾次，其中有多次都比 TR 1950X 高、但偶而會低於 TR 1950X )，更重要的是處理器、主機板加上散熱器的整體成本， Ryzen 9-3900X 顯然更為划算。

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▲ AORUS PCIe 4.0 SSD 在未能有多次反覆測試下仍達到趨近理論值的表現

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▲拜全銅散熱包覆，溫度控制相當理想

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▲ 3DMark PCI Express 的目的在於吃滿通道、但這並非消費者多數會遇到的使用情境

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▲ PCIe 4.0 通道確實大幅提升頻寬

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▲若搭配的是 PCIe 3.0 的顯示卡頻寬也會因此掉回 PCIe 3.0

此外這次也藉由取得 AORUS PCIe 4.0 SSD 的機會，測試 PCIe 4.0 的 SSD 表現，不過或許受到辦公室冷氣狀況不佳等因素，筆者最終得到的成績是趨近 5GBps 的表現，但也相當接近理論值；不過這還不是 PCIe 4.0 的全速表現，利用 3DMark 的新測試基準，可發現搭配 Radeon RX3900XT 之下最高的性能表現，不過 PCIe 4.0 需要處理器、主機板、顯示卡都支援的前提才有效果，若搭配 PCIe 3.0 顯示卡頻寬則會被打回原形。

R7-3700X 超值、 R9-3900X 越級挑戰專業平台

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▲由於仍採用 AM4 插槽，理論上既有主機板仍可相容一部份 Ryzen 3000 處理器

雖說在當代遊戲，光只有 CPU 多核性能不見得能佔優勢，但從此次 AMD 單核提升的幅度，至少在遊戲體驗不會像先前世代與 Intel 相近價位產品有一定程度的落差，尤其是支援新一代 API 如 Direct X 12 、 Vulkan 等可發揮多核與 GPU 性能的遊戲，也能有不遜色的表現，至於 Direct X 11 遊戲，也在體驗上相當近似。

就結果論，此次 Ryzen 3000 系列處理器來勢洶洶，以當前的性能與定價策略肯定對 Intel 平台有一定程度的影響，尤其此次測試的 Ryzen 7 3700X 的投資報酬率相當高，低發熱、性能表現也不惡，散熱器亦可順利與安靜的壓制非超頻下的發熱，筆者認為以遊戲玩家的角度相當值得考慮。

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▲ Ryzen 9 3900X 破壞小型工作站的最低建置成本、 Ryzen 7 3700X 則相當超值

Ryzen 9-3900X 雖就遊戲的角度不見得是最划算，但若把使用情境轉換到影音轉檔、準專業的運算研究等情境， Ryzen 9-3900X 不僅是可上打 TR 1950X ，而 Intel 平台甚至要選擇到台幣報價 36,000 元以上的產品才有 12 核心，終究專業平台有其如記憶體通道一類的優勢，但已經足夠讓消費者思索，更別忘了年末還有 16 核心的 Ryzen 9-3950X 蓄勢待發。

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